参数资料
型号: ICS413MT
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟及定时
英文描述: PLL BASED CLOCK DRIVER, 3 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO8
封装: 0.150 INCH, SOIC-8
文件页数: 3/5页
文件大小: 62K
代理商: ICS413MT
PC PERIPHERAL CLOCK
MDS 413 A
3
Revision 040202
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ICS413
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1) The 0.01F decoupling capacitor should be mounted
on the component side of the board as close to the
VDD pin as possible. No vias should be used between
decoupling capacitor and VDD pin. The PCB trace to
VDD pin should be kept as short as possible, as should
the PCB trace to the ground via.
2) To minimize EMI the 33
series termination resistor,
if needed, should be placed close to the clock output.
3) An optimum layout is one with all components on the
same side of the board, minimizing vias through other
signal layers. Other signal traces should be routed
away from the ICS413. This includes signal traces just
underneath the device, or on layers adjacent to the
ground plane layer used by the device.
Clock Selection at Power On
An external resistor selects either a 14.318 MHz or
24.576 MHz output clock on pin 6. A pull-up resistor
selects 14.318 MHz and, conversely, a pull-down
selects 24.576 MHz during Vdd ramp.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS413. These ratings, which
are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the
device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Recommended Operation Conditions
Item
Rating
Supply Voltage, VDD
7 V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Ambient Operating Temperature
0 to +70
°C
Storage Temperature
-65 to +150
°C
Junction Temperature
175
°C
Soldering Temperature
260
°C
Parameter
Min.
Typ.
Max.
Units
Ambient Operating Temperature
0
–+70
°C
Power Supply Voltage (measured in respect to GND)
+3.00
+3.60
V
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