参数资料
型号: ICS813323BGLF
厂商: IDT, Integrated Device Technology Inc
文件页数: 10/22页
文件大小: 0K
描述: IC ATTENUATOR/MULTIPLIER 24TSSOP
标准包装: 62
系列: HiPerClockS™, FemtoClock™
类型: 扇出配送,频率变换器,抖动衰减器,压控晶体振荡器(VCXO)
PLL: 带旁路
输入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
输出: LVPECL
电路数: 1
比率 - 输入:输出: 2:3
差分 - 输入:输出: 是/是
频率 - 最大: 622.08MHz
除法器/乘法器: 是/无
电源电压: 3.135 V ~ 3.465 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 24-TSSOP
包装: 管件
其它名称: 813323BGLF
ICS813323BG REVISION A APRIL 13, 2010
18
2010 Integrated Device Technology, Inc.
ICS813323 Data Sheet
VCXO JITTER ATTENUATOR & FEMTOCLOCKMULTIPLIER
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS813323.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS813323 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCCO = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCCO_MAX * IEE_MAX = 3.465V * 130mA = 450.45mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 3 * 30mW = 90mW
Total Power_MAX (3.3V, with all outputs switching) = 450.45mW + 90mW = 540.45mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 82.3°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.540W * 82.3°C/W = 114.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 24 Lead TSSOP, Forced Convection
θ
JA by Velocity
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
82.3°C/W
78.0°C/W
75.95°C/W
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