参数资料
型号: ICS83026BMI-01LF
厂商: IDT, Integrated Device Technology Inc
文件页数: 1/15页
文件大小: 0K
描述: IC CLK BUFFER 1:2 350MHZ 8-SOIC
标准包装: 97
系列: HiPerClockS™
类型: 扇出缓冲器(分配)
电路数: 1
比率 - 输入:输出: 1:2
差分 - 输入:输出: 是/无
输入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
输出: LVCMOS,LVTTL
频率 - 最大: 350MHz
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
其它名称: 83026BMI-01LF
ICS83026BMI-01LF-ND
83026BMI-01
1
REV. A AUGUST 4, 2010
ICS83026I-01
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
GENERAL DESCRIPTION
The ICS83026I-01 is a low skew, 1-to-2 Differential-to-
LVCMOS/LVTTL Fanout Buffer. The differential input can
accept most differential signal types (LVPECL, LVDS,
LVHSTL, HCSL and SSTL) and translate to two single-
ended LVCMOS/LVTTL outputs. The small 8-lead SOIC
footprint makes this device ideal for use in applications
with limited board space.
FEATURES
Two LVCMOS / LVTTL outputs
Differential CLK, nCLK input pair
CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL
Maximum output frequency: 350MHz
Output skew: 15ps (maximum)
Part-to-part skew: 600ps (maximum)
Additive phase jitter, RMS: 0.03ps (typical)
Small 8 lead SOIC package saves board space
3.3V core, 3.3V, 2.5V or 1.8V output operating supply
-40°C to 85°C ambient operating temperature
Available in both standard (RoHS 5) and lead-free RoHS
(6) packages
BLOCK DIAGRAM
PIN ASSIGNMENT
ICS83026I-01
8-Lead SOIC
3.8mm x 4.8mm, x 1.47mm package body
M Package
Top View
VDD
CLK
nCLK
OE
1
2
3
4
Q0
Q1
CLK
nCLK
OE
VDDO
Q0
Q1
GND
8
7
6
5
ICS83026I-01
8-Lead TSSOP
4.40mm x 3.0mm x 0.925mm
package body
G Package
Top View
VDD
CLK
nCLK
OE
1
2
3
4
VDDO
Q0
Q1
GND
8
7
6
5
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