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参数资料
| 型号： | ICS83908AGI-02LFT |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 13/13页 |
| 文件大小： | 0K |
| 描述： | IC CLOCK BUFFER MUX 3:8 24-TSSOP |
| 标准包装： | 2,500 |
| 系列： | HiPerClockS™ |
| 类型： | 扇出缓冲器（分配），多路复用器 |
| 电路数： | 1 |
| 比率 - 输入:输出： | 3:8 |
| 差分 - 输入:输出： | 无/无 |
| 输入： | LVCMOS，LVTTL，晶体 |
| 输出： | LVCMOS，LVTTL |
| 频率 - 最大： | 200MHz |
| 电源电压： | 2.375 V ~ 3.465 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 带卷 (TR) |
| 其它名称： | 83908AGI-02LFT |
Technical Note
9/10
www.rohm.com
2013.11 - Rev.D
2011 ROHM Co., Ltd. All rights reserved.
BA5406,BA5417
●
Notes for use
1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
2) Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to
verify circuit characteristics for your particular application. Modification of constants for other externally connected circuits
may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for
sufficient margins when determining circuit constants.
3) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage or operating temperature range (Topr),
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using the IC at times
where the absolute maximum ratings may be exceeded.
4) GND potential
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at
any time, regardless of whether it is a transient signal or not.
5) Thermal design
Perform thermal design, in which there are adequate margins, by taking into account the permissible dissipation (Pd) in
actual states of use.
6) Short circuit between terminals and erroneous mounting
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
7) Operation in strong electromagnetic field
Using the ICs in a strong electromagnetic field can cause operation malfunction.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS83908AGI-02T | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:LOW SKEW, 1-TO-8 CRYSTAL-TO-LVCMOS FANOUT BUFFER |
| ICS83908I-02 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:LOW SKEW, 1-TO-8 CRYSTAL-TO-LVCMOS FANOUT BUFFER |
| ICS83940 | 制造商:ICS 制造商全称:ICS 功能描述:LOW SKEW, 1-TO-18 LVCMOS FANOUT BUFFER |
| ICS83940-01 | 制造商:ICS 制造商全称:ICS 功能描述:LOW SKEW, 1-TO-18 LVCMOS FANOUT BUFFER |
| ICS83940-02 | 制造商:ICS 制造商全称:ICS 功能描述:LOW SKEW, 1-TO-18 LVCMOS FANOUT BUFFER |
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