- 您现在的位置：买卖IC网 > PDF目录2072 > ICS83940DYI-01LF (IDT, Integrated Device Technology Inc)IC CLOCK BUFFER MUX 2:18 32-LQFP PDF资料下载
参数资料
| 型号： | ICS83940DYI-01LF |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 6/18页 |
| 文件大小： | 0K |
| 描述： | IC CLOCK BUFFER MUX 2:18 32-LQFP |
| 标准包装： | 250 |
| 系列： | HiPerClockS™ |
| 类型： | 扇出缓冲器（分配），多路复用器 |
| 电路数： | 1 |
| 比率 - 输入:输出： | 2:18 |
| 差分 - 输入:输出： | 是/无 |
| 输入： | CML，LVCMOS，LVPECL，LVTTL，SSTL |
| 输出： | LVCMOS，LVTTL |
| 频率 - 最大： | 250MHz |
| 电源电压： | 2.375 V ~ 3.465 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-LQFP |
| 供应商设备封装： | 32-TQFP（7x7） |
| 包装： | 托盘 |
| 其它名称： | 83940DYI-01LF |
ICS83940DYI-01 REVISION A SEPTEMBER 27, 2010
14
2010 Integrated Device Technology, Inc.
ICS83940I-01 Data Sheet
LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS83940DI-01.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS83940DI-01 is the sum of the core power plus the power dissipated in the load(s). The following is the
power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)MAX = VDD_MAX * (IDD + IDDO) = 3.465V *(26mA + 28mA) = 187.11mW
Dynamic Power Dissipation at 175MHz
Power (175MHz) = CPD * Frequency * (VDD)
2 * number of outputs = 9pF * 175MHz * (3.465V)2 * 18 = 340.4mW
Total Power Dissipation
Total Power
= Power (core)MAX + Power (175MHz)
= 187.15mW + 340.4mW
= 527.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 53.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.528W * 53.5°C/W = 113.2°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will vary depending on the number of loaded outputs, supply voltage, air flow and the type of board
(multi-layer).
Table 6. Thermal Resistance θJA for 32 Lead LQFP, Forced Convection
θ
JA by Velocity
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
53.5°C/W
48.0°C/W
44.0°C/W
相关PDF资料 |
PDF描述 |
|---|---|
| ICS83940DYLFT | IC CLOCK BUFFER MUX 2:18 32-LQFP |
| ICS83948AYI-147LF | IC CLOCK BUFFER MUX 2:12 32-LQFP |
| ICS83PR226BKI-01LF | IC SYNTHESIZER PROGR 10-VFQFPN |
| ICS840001AK-34LF | IC FREQ SYNTHESIZER 16-VFQFPN |
| ICS840001AKI-34LFT | IC FREQ SYNTHESIZER 16-VFQFPN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS83940DYI-01LFT | 功能描述:IC CLOCK BUFFER MUX 2:18 32-LQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS83940DYI-01T | 制造商:ICS 制造商全称:ICS 功能描述:LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS / LVTTL FANOUT BUFFER |
| ICS83940DYILF | 功能描述:IC CLOCK BUFFER MUX 2:18 32-LQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS83940DYILFT | 功能描述:IC CLOCK BUFFER MUX 2:18 32-LQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS83940DYIT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 2:18 250MHZ 32TQFP |
发布紧急采购，3分钟左右您将得到回复。