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| 型号： | ICS840001AKI-34LFT |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟产生/分配 |
| 英文描述： | 213.33 MHz, OTHER CLOCK GENERATOR, QCC16 |
| 封装： | 3 X 3 MM, 0.95 MM HEIGHT, ROHS COMPLIANT, MO-220, VFQFN-16 |
| 文件页数： | 2/14页 |
| 文件大小： | 697K |
| 代理商： | ICS840001AKI-34LFT |
ICS840001I-34
FEMTOCLOCKS CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER
IDT / ICS LVCMOS/LVTTL FREQUENCY SYNTHESIZER
10
ICS840001I-34 REV. A FEBRUARY 15, 2007
LVCMOS to XTAL Interface
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure 3. The XTAL_OUT pin can be left floating. The
input edge rate can be as slow as 10ns. For LVCMOS inputs, it is
recommended that the amplitude be reduced from full swing to half
swing in order to prevent signal interference with the power rail and
to reduce noise. This configuration requires that the output
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination
at the crystal input will attenuate the signal in half. This can be
done in one of two ways. First, R1 and R2 in parallel should equal
the transmission line impedance. For most 50
applications, R1
and R2 can be 100
. This can also be accomplished by removing
R1 and making R2 50
.
Figure 3. General Disgram for LVCMOS Driver to XTAL Input Interface
Thermal Release Path
The expose metal pad provides heat transfer from the device to the
P.C. board. The expose metal pad is ground pad connected to
ground plane through thermal via. The exposed pad on the device
to the exposed metal pad on the PCB is contacted through solder
as shown in Figure 4. For further information, please refer to the
Application Note on Surface Mount Assembly of Amkor’s
Thermally /Electrically Enhance Leadframe Base Package, Amkor
Technology.
Figure 4. P.C. Board for Exposed Pad Thermal Release Path Example
XTAL_IN
XTAL_OUT
Ro
Rs
Zo = Ro + Rs
50
0.1f
R1
R2
VCC
EXPOSED PAD
Expose Metal Pad
(GROUND PAD)
GROUND PLANE
SOLDER
SIGNAL
TRACE
SIGNAL
TRACE
THERMAL VIA
SOLDER MASK
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS840001BG | 制造商:ICSI 制造商全称:Integrated Circuit Solution Inc 功能描述:FEMTOCLOCKS⑩ CRYSTAL-TO-LVCMOS/LVTTL CLOCK GENERATOR |
| ICS840001BGI-25LF | 功能描述:IC CLOCK GEN FIBRE CHAN 8-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS840001BGI-25LFT | 功能描述:IC CLOCK GEN FIBRE CHAN 8-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS840001BGLF | 功能描述:IC CLK GEN FIBRE CHAN 8-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:1,000 系列:Precision Edge® 类型:时钟/频率合成器 PLL:无 输入:CML，PECL 输出:CML 电路数:1 比率 - 输入:输出:2:1 差分 - 输入:输出:是/是 频率 - 最大:10.7GHz 除法器/乘法器:无/无 电源电压:2.375 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) 其它名称:SY58052UMGTRSY58052UMGTR-ND |
| ICS840001BGLFT | 功能描述:IC CLOCK GEN FIBRE CHAN 8-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
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