参数资料
型号: ICS841654AGILFT
厂商: IDT, Integrated Device Technology Inc
文件页数: 4/17页
文件大小: 0K
描述: IC CLOCK GENERATOR 28-TSSOP
标准包装: 1,000
系列: HiPerClockS™, FemtoClock™
类型: 时钟发生器,扇出配送,多路复用器
PLL: 带旁路
输入: LVCMOS,LVTTL,晶体
输出: HCSL,LVCMOS,LVTTL
电路数: 1
比率 - 输入:输出: 2:5
差分 - 输入:输出: 无/是
频率 - 最大: 125MHz
除法器/乘法器: 是/无
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-TSSOP(0.240",6.10mm 宽)
供应商设备封装: 28-TSSOP
包装: 带卷 (TR)
其它名称: 841654AGILFT
IDT / ICS HCSL CLOCK GENERATOR
12
ICS841654AGI REV. A APRIL 17, 2008
ICS841654I
FEMTOCLOCKS CRYSTAL-TO-HCSL CLOCK GENERATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS841654I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS841654I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
DD_MAX
* I
DD_MAX
= 3.465V * 85mA = 294.5mW
Power (outputs)
MAX
= 50.06mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 50.06mW = 200.24mW
Total Power
_MAX
(3.465V, with all outputs switching) = 294.5mW + 200.24mW = 494.74mW
2.
Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in Section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air
flow and a multi-layer board, the appropriate value is 64.5°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.495W * 64.5°C/W = 116.9°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
28-LEAD TSSOP, FORCED CONVECTION
θθθθθ
JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
64.5°C/W
60.4°C/W
58.5°C/W
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