参数资料
型号: ICS843021AGI-01LF
厂商: IDT, Integrated Device Technology Inc
文件页数: 3/16页
文件大小: 0K
描述: IC CLK GEN 1GIG LVPECL 8-TSSOP
特色产品: Gigabit Ethernet Clock Synthesizer
标准包装: 96
系列: HiPerClockS™, FemtoClock™
类型: 时钟/频率合成器,时钟发生器
PLL:
输入: 晶体
输出: LVPECL
电路数: 1
比率 - 输入:输出: 1:1
差分 - 输入:输出: 无/是
频率 - 最大: 160MHz
除法器/乘法器: 是/无
电源电压: 2.375 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 管件
产品目录页面: 1250 (CN2011-ZH PDF)
其它名称: 800-1132
800-1132-5
800-1132-ND
843021AGI-01LF
ICS843021AGI-01 REVISION A OCTOBER 15, 2010
11
2010 Integrated Device Technology, Inc.
ICS843021I-01 Data Sheet
FEMTOCLOCK CRYSTAL-TO-3.3V, 2.5V LVPECL CLOCK GENERATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS843021I-01.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS843021I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 64mA = 221.76mW
Power (outputs)MAX = 30mW/Loaded Output pair
Total Power_MAX (3.465V, with all outputs switching) = 221.76mW + 30mW = 251.76mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 129.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.252W * 90.5°C/W = 117.6°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 8 Lead TSSOP, Forced Convection
θ
JA by Velocity
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
129.5°C/W
125.5°C/W
123.5°C/W
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