参数资料
型号: ICS8430S07AKILF
厂商: IDT, Integrated Device Technology Inc
文件页数: 9/26页
文件大小: 0K
描述: IC CLK GENERATOR PLL 32VFQFN
标准包装: 490
类型: 时钟/频率发生器,扇出缓冲器(分配),多路复用器
PLL:
主要目的: Cavium 处理器
输入: LVCMOS,LVDS,LVPECL,LVTTL,SSTL,晶体
输出: LVCMOS,LVPECL,LVTTL
电路数: 1
比率 - 输入:输出: 2:7
差分 - 输入:输出: 是/是
频率 - 最大: 133.33MHz
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-VFQFN(5x5)
包装: 托盘
ICS8430S07AKI REVISION A SEPTEMBER 3, 2009
17
2009 Integrated Device Technology, Inc.
ICS8430S07I Data Sheet
CLOCK GENERATOR FOR CAVIUM PROCESSORS
VFQFN EPAD Thermal Release Path
In order to maximize both the removal of heat from the package and
the electrical performance, a land pattern must be incorporated on
the Printed Circuit Board (PCB) within the footprint of the package
corresponding to the exposed metal pad or exposed heat slug on the
package, as shown in Figure 7. The solderable area on the PCB, as
defined by the solder mask, should be at least the same size/shape
as the exposed pad/slug area on the package to maximize the
thermal/electrical performance. Sufficient clearance should be
designed on the PCB between the outer edges of the land pattern
and the inner edges of pad pattern for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat transfer
and electrical grounding from the package to the board through a
solder joint, thermal vias are necessary to effectively conduct from
the surface of the PCB to the ground plane(s). The land pattern must
be connected to ground through these vias. The vias act as “heat
pipes”. The number of vias (i.e. “heat pipes”) are application specific
and dependent upon the package power dissipation as well as
electrical conductivity requirements. Thus, thermal and electrical
analysis and/or testing are recommended to determine the minimum
number needed. Maximum thermal and electrical performance is
achieved when an array of vias is incorporated in the land pattern. It
is recommended to use as many vias connected to ground as
possible. It is also recommended that the via diameter should be 12
to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is
desirable to avoid any solder wicking inside the via during the
soldering process which may result in voids in solder between the
exposed pad/slug and the thermal land. Precautions should be taken
to eliminate any solder voids between the exposed heat slug and the
land pattern. Note: These recommendations are to be used as a
guideline only. For further information, please refer to the Application
Note on the Surface Mount Assembly of Amkor’s Thermally/
Electrically Enhance Leadframe Base Package, Amkor Technology.
Figure 7. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale)
SOLDER
PIN
EXPOSED HEAT SLUG
PIN PAD
GROUND PLANE
LAND PATTERN
(GROUND PAD)
THERMAL VIA
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ICS8430S07AKILFT 功能描述:IC CLK GENERATOR PLL 32VFQFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:- 标准包装:1,500 系列:- 类型:时钟缓冲器/驱动器 PLL:是 主要目的:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 电源电压:3.3V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SSOP(0.209",5.30mm 宽) 供应商设备封装:28-SSOP 包装:带卷 (TR) 其它名称:93786AFT
ICS8430S07I 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:Clock Generator for Cavium Processors
ICS8430S10AYILF 功能描述:IC CLK GENERATOR PLL 48TQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:- 标准包装:1,500 系列:- 类型:时钟缓冲器/驱动器 PLL:是 主要目的:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 电源电压:3.3V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SSOP(0.209",5.30mm 宽) 供应商设备封装:28-SSOP 包装:带卷 (TR) 其它名称:93786AFT
ICS8430S10AYILFT 功能描述:IC CLK GENERATOR PLL 48TQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:- 标准包装:1,500 系列:- 类型:时钟缓冲器/驱动器 PLL:是 主要目的:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 电源电压:3.3V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SSOP(0.209",5.30mm 宽) 供应商设备封装:28-SSOP 包装:带卷 (TR) 其它名称:93786AFT
ICS8430S10BYI-02LF 功能描述:IC CLK GENERATOR PLL 48TQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:- 标准包装:1,500 系列:- 类型:时钟缓冲器/驱动器 PLL:是 主要目的:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 电源电压:3.3V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SSOP(0.209",5.30mm 宽) 供应商设备封装:28-SSOP 包装:带卷 (TR) 其它名称:93786AFT