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参数资料
| 型号： | ICS84320AY-01LN |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟产生/分配 |
| 英文描述： | 780 MHz, OTHER CLOCK GENERATOR, PQFP32 |
| 封装： | 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBA, LQFP-32 |
| 文件页数： | 6/21页 |
| 文件大小： | 1047K |
| 代理商： | ICS84320AY-01LN |
84320AY-01
14
REV. C OCTOBER 22, 2007
ICS84320-01
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
FIGURE 7. P.C.ASSEMBLY FOR EXPOSED PAD THERMAL RELEASE PATH –SIDE VIEW (DRAWING NOT TO SCALE)
VFQFN EPADTHERMAL RELEASE PATH
In order to maximize both the removal of heat from the package
and the electrical performance, a land pattern must be
incorporated on the Printed Circuit Board (PCB) within the
footprint of the package corresponding to the exposed metal
pad or exposed heat slug on the package, as shown in Figure
7. The solderable area on the PCB, as defined by the solder
mask, should be at least the same size/shape as the exposed
pad/slug area on the package to maximize the thermal/
electrical performance. Sufficient clearance should be
designed on the PCB between the outer edges of the land
pattern and the inner edges of pad pattern for the leads to
avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s).
The land pattern must be connected to ground through these
vias. The vias act as “heat pipes”. The number of vias (i.e.
“heat pipes”) are application specific and dependent upon
the package power dissipation as well as electrical
conductivity requirements. Thus, thermal and electrical
analysis and/or testing are recommended to determine the
minimum number needed. Maximum thermal and electrical
performance is achieved when an array of vias is incorporated
in the land pattern. It is recommended to use as many vias
connected to ground as possible. It is also recommended that
the via diameter should be 12 to 13mils (0.30 to 0.33mm) with
1oz copper via barrel plating. This is desirable to avoid any
solder wicking inside the via during the soldering process
which may result in voids in solder between the exposed
pad/slug and the thermal land. Precautions should be taken
to eliminate any solder voids between the exposed heat slug
and the land pattern. Note: These recommendations are to be
used as a guideline only. For further information, refer to the
Application Note on the Surface Mount Assembly of Amkor’s
Thermally/Electrically Enhance Leadfame Base Package,
Amkor Technology.
THERMAL VIA
LAND PATTERN
SOLDER
PIN
SOLDER
PIN PAD
PIN
GROUND PLANE
EXPOSED HEAT SLUG
(GROUND PAD)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS84320AY-01LNT | 功能描述:IC SYNTHESIZER 780MHZ 32-LQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS84320AY-01T | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL LVPECL FREQUENCY SYNTHESIZER |
| ICS84320AYI-01 | 制造商:ICS 制造商全称:ICS 功能描述:780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL |
| ICS84320AYI-01LF | 功能描述:IC FREQ SYNTHESIZER 32TQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:27 系列:Precision Edge® 类型:频率合成器 PLL:是 输入:PECL，晶体 输出:PECL 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/是 频率 - 最大:800MHz 除法器/乘法器:是/无 电源电压:3.135 V ~ 5.25 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| ICS84320AYI-01LFT | 功能描述:IC FREQ SYNTHESIZER 32TQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:27 系列:Precision Edge® 类型:频率合成器 PLL:是 输入:PECL，晶体 输出:PECL 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/是 频率 - 最大:800MHz 除法器/乘法器:是/无 电源电压:3.135 V ~ 5.25 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
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