参数资料
型号: ICS843252AG
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟产生/分配
英文描述: 680 MHz, OTHER CLOCK GENERATOR, PDSO16
封装: 4.40 X 5 MM, 0.92 MM HEIGHT, MO-153, TSSOP-16
文件页数: 3/15页
文件大小: 447K
代理商: ICS843252AG
843252AG
11
REV. A JANUARY 15, 2008
ICS843252
FEMTOCLOCKSCRYSTAL-TO-3.3V LVPECL
FREQUENCY SYNTHESIZER
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843252.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843252 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 122mA = 422.73mW
Power (outputs)
MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power
_MAX (3.465V, with all outputs switching) = 422.73mW + 60mW = 482.73mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used.
Assuming no air flow and a multi-layer board, the appropriate value is 92.4°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.483W * 92.4°C/W = 114.6°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 7.THERMAL RESISTANCE
θθθθθ
JA FOR 16-PIN TSSOP, FORCED CONVECTION
θθθθθ
JA by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
92.4°C/W
88.0°C/W
85.9°C/W
相关PDF资料
PDF描述
ICS843256AGILF 333.33 MHz, OTHER CLOCK GENERATOR, PDSO24
ICS843256AMI 333.33 MHz, OTHER CLOCK GENERATOR, PDSO24
ICS843256AMIT 333.33 MHz, OTHER CLOCK GENERATOR, PDSO24
ICS843256AGIT 333.33 MHz, OTHER CLOCK GENERATOR, PDSO24
ICS843256AMLFT 333.33 MHz, OTHER CLOCK GENERATOR, PDSO24
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