参数资料
型号: ICS8432DYI-101LF
厂商: IDT, Integrated Device Technology Inc
文件页数: 5/20页
文件大小: 0K
描述: IC SYNTHESIZER 700MHZ 32-LQFP
标准包装: 250
系列: HiPerClockS™
类型: 频率合成器
PLL: 带旁路
输入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
输出: LVPECL
电路数: 1
比率 - 输入:输出: 1:2
差分 - 输入:输出: 是/是
频率 - 最大: 700MHz
除法器/乘法器: 是/无
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-LQFP
供应商设备封装: 32-TQFP(7x7)
包装: 托盘
其它名称: 8432DYI-101LF
IDT / ICS 700MHZ, 3.3V LVPECL FREQUENCY SYNTHESIZER
13
ICS8432DYI-101 REV. C APRIL 10, 2007
ICS8432I-101
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
GND
Close to the input
pins of the
receiver
U1
R3
VCCA
TL1
C14
PIN 1
TL1N
TL1
VCC
R4
C11
C16
C15
TL1, TL2 are 50 Ohm traces and
equal length
R1
TL1N
R7
VIA
R2
The following component footprints are used in this layout
example: All the resistors and capacitors are size 0603.
POWER AND GROUNDING
Place the decoupling capacitors C14 and C15 as close as possible
to the power pins. If space allows, placing the decoupling capacitor
at the component side is preferred. This can reduce unwanted
inductance between the decoupling capacitor and the power pin
generated by the via.
Maximize the pad size of the power (ground) at the decoupling
capacitor. Maximize the number of vias between power (ground)
and the pads. This can reduce the inductance between the power
(ground) plane and the component power (ground) pins.
If V
CCA
shares the same power supply with V
CC
, insert the RC filter
R7, C11, and C16 in between. Place this RC filter as close to the
V
CCA
as possible.
CLOCK TRACES AND TERMINATION
The component placements, locations and orientations should be
arranged to achieve the best clock signal quality. Poor clock signal
quality can degrade the system performance or cause system failure.
In the synchronous high-speed digital system, the clock signal is
less tolerable to poor signal quality than other signals. Any ringing
on the rising or falling edge or excessive ring back can cause system
failure. The trace shape and the trace delay might be restricted by
the available space on the board and the component location. While
routing the traces, the clock signal traces should be routed first and
should be locked prior to routing other signal traces.
The traces with 50
Ω transmission lines TL1 and TL2 at
FOUT and nFOUT should have equal delay and run ad-
jacent to each other. Avoid sharp angles on the clock trace.
Sharp angle turns cause the characteristic impedance to
change on the transmission lines.
Keep the clock trace on same layer. Whenever possible,
avoid any vias on the clock traces. Any via on the trace
can affect the trace characteristic impedance and hence
degrade signal quality.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow more space between the clock trace
and the other signal trace.
Make sure no other signal trace is routed between the
clock trace pair.
The matching termination resistors R1, R2, R3 and R4 should
be located as close to the receiver input pins as possible. Other
termination schemes can also be used but are not shown in this
example.
FIGURE 6B. PCB BOARD LAYOUT FOR ICS8432I-101
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