参数资料
型号: ICS84330CM-01LF
厂商: IDT, Integrated Device Technology Inc
文件页数: 5/19页
文件大小: 0K
描述: IC FREQ SYNTHESIZER 28SOIC
标准包装: 26
系列: HiPerClockS™
类型: 频率合成器
PLL:
输入: 晶体
输出: LVPECL
电路数: 1
比率 - 输入:输出: 1:1
差分 - 输入:输出: 无/是
频率 - 最大: 700MHz
除法器/乘法器: 是/无
电源电压: 3.135 V ~ 3.465 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.295",7.50mm 宽)
供应商设备封装: 28-SOIC
包装: 管件
ICS84330-01 Data Sheet
700MHZ, LOW JITTER, CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
ICS84330CM-01 REVISION A FEBRUARY 23, 2010
13
2010 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS84330-01.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS84330-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 160mA = 554.4mW
Power (outputs)MAX = 30mW/Loaded Output pair
Total Power_MAX (3.3V, with all outputs switching) = 554.4mW + 30mW = 584.4mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 57°C/W per Table 8A below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.584W * 57°C/W = 103.3°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 8A. Thermal Resistance θJA for 28 Lead SOIC, Forced Convection
Table 8B. Thermal Resistance θJA for 28 Lead PLCC, Forced Convection
θ
JA by Velocity
Meters per Second
0
Multi-Layer PCB, JEDEC Standard Test Boards
57°C/W
θ
JA by Velocity
Meters per Second
0
Multi-Layer PCB, JEDEC Standard Test Boards
45.7°C/W
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