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| 型号： | ICS8524AYT |
| 元件分类： | 时钟及定时 |
| 英文描述： | LOW SKEW CLOCK DRIVER, 22 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP64 |
| 封装： | 10 X 10 MM, 1 MM HEIGHT, MS-026, TQFP-64 |
| 文件页数： | 4/17页 |
| 文件大小： | 234K |
| 代理商： | ICS8524AYT |
8524AY
www.icst.com/products/hiperclocks.html
REV. B NOVEMBER 19, 2004
12
Integrated
Circuit
Systems, Inc.
ICS8524
LOW SKEW, 1-TO-22
DIFFERENTIAL-TO-HSTL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8524.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8524 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VDD_MAX * IDD_MAX = 3.465V * 220mA = 762.3mW
Power (outputs)
MAX = 32.8mW/Loaded Output pair
If all outputs are loaded, the total power is 22 * 32.8mW = 721.6mW
Total Power
_MAX (3.465V, with all outputs switching) = 762.3mW + 721.6mW = 1483.9mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming an
air flow of 500 linear feet per minute and a multi-layer board, the appropriate value is 15.1°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 1.484W * 15.1°C/W = 107.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
22.3°C/W
17.2°C/W
15.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
64-PIN TQFP, E-PAD FORCED CONVECTION
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相关代理商/技术参数 |
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| ICS8525BGLFT | 功能描述:IC CLOCK BUFFER MUX 2:4 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS852911AVILF | 功能描述:IC CLOCK BUFFER MUX 2:9 28-PLCC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS852911AVILFT | 功能描述:IC CLOCK BUFFER MUX 2:9 28-PLCC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
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