参数资料
型号: ICS853031AYLF
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟及定时
英文描述: 853031 SERIES, LOW SKEW CLOCK DRIVER, 9 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32
封装: 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBA, LQFP-32
文件页数: 7/21页
文件大小: 1136K
代理商: ICS853031AYLF
IDT / ICS 1-TO-9, 2.5V, 3.3V LVPECL/ECL FANOUT BUFFER
15
ICS853031 REV C JUNE 26, 2006
ICS853031
LOW SKEW, 1-TO-9, DIFFERENTIAL-TO-2.5, 3.3V LVPECL/ECL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS853031.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS853031 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V ± 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 77mA = 266.8mW
Power (outputs)
MAX
= 30.2mW/Loaded Output pair
If all outputs are loaded, the total power is 9 * 30.94mW = 278.5mW
Total Power
_MAX
(3.465V, with all outputs switching) = 266.8mW + 278.5mW = 545.3mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.545W * 42.1°C/W = 108°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
55.9°C/W
50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
47.9°C/W
42.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
32-PIN LQFP FORCED CONVECTION
相关PDF资料
PDF描述
ICS853031AYT 853031 SERIES, LOW SKEW CLOCK DRIVER, 9 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32
ICS85304AG-01T 85304 SERIES, LOW SKEW CLOCK DRIVER, 5 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20
ICS85304AG-01LFT 85304 SERIES, LOW SKEW CLOCK DRIVER, 5 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20
ICS85304AG-01T LOW SKEW CLOCK DRIVER, 5 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20
ICS85304AG-01LF LOW SKEW CLOCK DRIVER, 5 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20
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