参数资料
型号: ICS8530DYI-01LFT
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟及定时
英文描述: 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
封装: 7 X 7 MM, 1 MM HEIGHT, MS-026, TQFP-48
文件页数: 5/17页
文件大小: 230K
代理商: ICS8530DYI-01LFT
8530DYI-01
13
REV. A JANUARY 16, 2008
ICS8530I-01
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8530I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8530I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 115mA = 398.5mW
Power (outputs)
MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 16 * 30mW = 480mW
Total Power
_MAX (3.465V, with all outputs switching) = 398.5mW + 480mW = 878.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 22.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.879W * 22.6°C/W = 104.9°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA FOR 48-PIN TQFP, E-PAD FORCED CONVECTION
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
27.6°C/W
22.6°C/W
20.7°C/W
相关PDF资料
PDF描述
ICS8530DYI-01 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
ICS8530DYI-01T 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
ICS8530DY 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
ICS85310AY-01LFT LOW SKEW CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32
ICS85310AY-01LF LOW SKEW CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32
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