参数资料
型号: ICS8531AY-01T
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟及定时
英文描述: 8531 SERIES, LOW SKEW CLOCK DRIVER, 9 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32
封装: 7 X 7 MM, 1.40 MM HEIGHT, MS-026BBA, LQFP-32
文件页数: 4/18页
文件大小: 297K
代理商: ICS8531AY-01T
IDT / ICS 1-TO-9, 3.3V LVPECL FANOUT BUFFER
12
ICS8531AY-01 REV. F APRIL 11, 2007
ICS8531-01
LOW SKEW, 1-TO-9, DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8531-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8531-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 80mA = 277.2mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
If all outputs are loaded, the total power is 9 * 30mW = 270mW
Total Power
_MAX
(3.465V, with all outputs switching) = 277.2mW + 270mW = 547.2mW
2.
Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.547W * 42.1°C/W = 93°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
55.9°C/W
50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
47.9°C/W
42.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
32-PIN LQFP FORCED CONVECTION
相关PDF资料
PDF描述
ICS8531AY-01LF 8531 SERIES, LOW SKEW CLOCK DRIVER, 9 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32
ICS8531AY-01 LOW SKEW CLOCK DRIVER, 9 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32
ICS8532AY-01LF LOW SKEW CLOCK DRIVER, 17 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP52
ICS8532BY-01T 8532 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP52
ICS8532BY-01LF 8532 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP52
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