参数资料
型号: ICS8533AG-11LF
元件分类: 时钟及定时
英文描述: 8533 SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20
封装: 6.50 X 4.40 MM, 0.92 MM HEIGHT, LEAD FREE, MS-153, TSSOP-20
文件页数: 1/15页
文件大小: 209K
代理商: ICS8533AG-11LF
8533AG-11
www.icst.com/products/hiperclocks.html
REV. E DECEMBER 14, 2004
1
Integrated
Circuit
Systems, Inc.
ICS8533-11
LOW SKEW, 1-TO-4, CRYSTAL OSCILLATOR/
DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
GENERAL DESCRIPTION
The ICS8533-11 is a low skew, high performance
1-to-4 Crystal Oscillator/Differential-to-3.3V
LVPECL fanout buffer and a member of the
HiPerClockSfamily of High Performance Clock
Solutions from ICS. The ICS8533-11 has select-
able differential clock or crystal inputs. The CLK, nCLK pair
can accept most standard differential input levels. The clock
enable is internally synchronized to eliminate runt pulses on
the outputs during asynchronous assertion/deassertion of the
clock enable pin.
Guaranteed output and part-to-part skew characteristics
make the ICS8533-11 ideal for those applications demand-
ing well defined performance and repeatability.
FEATURES
4 differential 3.3V LVPECL outputs
Selectable differential CLK, nCLK or crystal inputs
CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL
Maximum output frequency: 650MHz
Translates any single-ended input signal to 3.3V
LVPECL levels with resistor bias on nCLK input
Output skew: 30ps (maximum)
Part-to-part skew: 150ps (maximum)
Propagation delay: 2ns (maximum)
3.3V operating supply
0°C to 70°C ambient operating temperature
Industrial temperature information available upon request
Lead-Free package fully RoHS compliant
BLOCK DIAGRAM
PIN ASSIGNMENT
ICS8533-11
20-Lead TSSOP
6.5mm x 4.4mm x 0.92 package body
G Package
Top View
VEE
CLK_EN
CLK_SEL
CLK
nCLK
XTAL1
XTAL2
nc
VCC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Q0
nQ0
VCC
Q1
nQ1
Q2
nQ2
VCC
Q3
nQ3
HiPerClockS
ICS
CLK
nCLK
XTAL1
XTAL2
Q0
nQ0
Q1
nQ1
Q2
nQ2
Q3
nQ3
0
1
CLK_EN
CLK_SEL
D
Q
LE
相关PDF资料
PDF描述
ICS8534AY-01T 8534 SERIES, LOW SKEW CLOCK DRIVER, 22 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP64
ICS8534AY-01LF 8534 SERIES, LOW SKEW CLOCK DRIVER, 22 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP64
ICS8534BMI-13LFT 266 MHz, OTHER CLOCK GENERATOR, PDSO16
ICS8534BMI-13T 266 MHz, OTHER CLOCK GENERATOR, PDSO16
ICS8534BMI-13 266 MHz, OTHER CLOCK GENERATOR, PDSO16
相关代理商/技术参数
参数描述
ICS8533AGI-01LF 功能描述:IC CLOCK BUFFER MUX 2:4 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器,驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器(分配) 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML,LVDS,LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘,16-MLF? 供应商设备封装:16-MLF?(3x3) 包装:带卷 (TR)
ICS8533AGI-01LFT 功能描述:IC CLOCK BUFFER MUX 2:4 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器,驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器(分配) 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL,LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN(5x5) 包装:管件
ICS8533AGI-31LF 功能描述:IC CLOCK BUFFER MUX 2:4 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器,驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器(分配) 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL,LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN(5x5) 包装:管件
ICS8533AGI-31LFT 功能描述:IC CLOCK BUFFER MUX 2:4 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器,驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器(分配) 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL,LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN(5x5) 包装:管件
ICS8534AY-01LF 功能描述:IC CLOCK BUFFER MUX 2:22 64-TQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器,驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器(分配) 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML,LVDS,LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘,16-MLF? 供应商设备封装:16-MLF?(3x3) 包装:带卷 (TR)