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| 型号： | ICS85354AK-01 |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 编、解码器及复用、解复用 |
| 英文描述： | 85354 SERIES, 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC16 |
| 封装： | 3 X 3 MM, 0.95 MM HEIGHT, MO-220, VQFN-16 |
| 文件页数： | 6/18页 |
| 文件大小： | 301K |
| 代理商： | ICS85354AK-01 |
85354AK-01
14
REV. A JANUARY 16, 2008
ICS85354-01
DUAL 2:1/1:2
DIFFERENTIAL-TO-LVPECL/ECL MULTIPLEXER
PRELIMINARY
θθθθθ
JA vs. 0 Air Flow (Linear Feet per Minute)
0
Multi-Layer PCB, JEDEC Standard Test Boards
51.5°C/W
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
16-PIN VFQFN, FORCED CONVECTION
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS85354-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85354-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 40mA = 138.6mW
Power (outputs)
MAX = 30.92mW/Loaded Output pair
If all outputs are loaded, the total power is 3 * 30.92mW = 92.76mW
Total Power
_MAX (3.465, with all outputs switching) = 138.6mW + 92.76mW = 231.4mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used.
Assuming 0 air flow and a multi-layer board, the appropriate value is 51.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.231W * 51.5°C/W = 96.9°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow,
and the type of board (single layer or multi-layer).
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相关代理商/技术参数 |
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| ICS85354AK-01LF | 功能描述:IC CLOCK MUX 2:1/1:2 16-VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS85354AK-01LFT | 功能描述:IC CLOCK MUX 2:1/1:2 16-VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS85354AKLF | 功能描述:IC CLOCK MUX 2:1/1:2 16-VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:1 系列:HiPerClockS™ 类型:扇出缓冲器（分配），多路复用器 电路数:1 比率 - 输入:输出:2:18 差分 - 输入:输出:是/无 输入:CML，LVCMOS，LVPECL，LVTTL，SSTL 输出:LVCMOS，LVTTL 频率 - 最大:250MHz 电源电压:2.375 V ~ 3.465 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:32-LQFP 供应商设备封装:32-TQFP（7x7） 包装:- 其它名称:800-1923-6 |
| ICS85354AKLFT | 功能描述:IC CLOCK MUX 2:1/1:2 16-VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:1 系列:HiPerClockS™ 类型:扇出缓冲器（分配），多路复用器 电路数:1 比率 - 输入:输出:2:18 差分 - 输入:输出:是/无 输入:CML，LVCMOS，LVPECL，LVTTL，SSTL 输出:LVCMOS，LVTTL 频率 - 最大:250MHz 电源电压:2.375 V ~ 3.465 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:32-LQFP 供应商设备封装:32-TQFP（7x7） 包装:- 其它名称:800-1923-6 |
| ICS85356AGILF | 功能描述:IC CLOCK MUX 2:1 900MHZ 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
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