ICS8536AG-02LF (IDT,) PDF资料下载 Datasheet(14/17 页)

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型号：	ICS8536AG-02LF
厂商：	IDT, Integrated Device Technology Inc
文件页数：	14/17页
文件大小：	0K
描述：	IC CLOCK BUFFER MUX 3:6 24-TSSOP
标准包装：	62
系列：	HiPerClockS™
类型：	扇出缓冲器（分配），多路复用器
电路数：	1
比率 - 输入:输出：	3:6
差分 - 输入:输出：	无/是
输入：	LVCMOS，LVTTL，晶体
输出：	LVPECL
频率 - 最大：	266MHz
电源电压：	2.375 V ~ 3.465 V
工作温度：	0°C ~ 70°C
安装类型：	表面贴装
封装/外壳：	24-TSSOP（0.173"，4.40mm 宽）
供应商设备封装：	24-TSSOP
包装：	管件

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ICS8536AG-02 REVISION A JULY 21, 2010

2010 Integrated Device Technology, Inc.

ICS8536-02 Data Sheet

1-TO-6, DUALCRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FANOUT BUFFER

AC Electrical Characteristics

Table 6A. AC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C

NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is

mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium

has been reached under these conditions.

NOTE: All parameters measured at fOUT unless noted otherwise.

NOTE 1: Measured from VCC/2 of the input crossing point to the differential output crossing point.

NOTE 2: Driving CLK0 input.

NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential

cross points.

NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.

NOTE 5: Defined as skew between outputs on different devices operating at the same supply voltage, same temperature, same frequency and

with equal load conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross points.

NOTE 6: Measured on either XTAL0 or XTAL1 when single-ended CLK0 switching at 150MHz or 250MHz.

Table 6B. AC Characteristics, VCC = 2.5V ± 5%, VEE = 0V, TA = 0°C to 70°C

NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is

mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium

has been reached under these conditions.

NOTE: All parameters measured at fOUT unless noted otherwise.

NOTE 1: Measured from VCC/2 of the input crossing point to the differential output crossing point.

NOTE 2: Driving CLK0 input.

NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential

cross points.

NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.

NOTE 5: Defined as skew between outputs on different devices operating at the same supply voltage, same temperature, same frequency and

with equal load conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross points.

NOTE 6: Measured on either XTAL0 or XTAL1 when single-ended CLK0 switching at 150MHz or 250MHz.

Symbol

Parameter

Test Conditions

Minimum

Typical

Maximum

Units

fOUT

Output Frequency

266

MHz

tPD

Propagation Delay; NOTE 1

1.35

1.85

tjit

Buffer Additive Phase Jitter, RMS;

NOTE 2

155.52MHz, Integration Range:

12kHz – 20MHz

0.149

tsk(o)

Output skew; NOTE 3, 4

tsk(pp)

Part-to-Part skew; NOTE 4, 5

500

tR / tF

Output Rise/Fall Time

20% to 80%

200

700

odc

Output Duty Cycle

MUX_ISOLATION MUX Isolation; NOTE 6

= 150MHz

= 250MHz