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参数资料
| 型号： | ICS8536CGI-33T |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟产生/分配 |
| 英文描述： | 266 MHz, OTHER CLOCK GENERATOR, PDSO20 |
| 封装： | MO-153, TSSOP-20 |
| 文件页数： | 3/16页 |
| 文件大小： | 408K |
| 代理商： | ICS8536CGI-33T |
IDT / ICS 3.3V, 2.5V LVPECL/ LVCMOS FANOUT BUFFER
11
ICS8536CGI-33 REV. B FEBRUARY 6, 2007
ICS8536I-33
LOW SKEW, 1-TO-6, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V, 2.5V LVPECL/LVCMOS FANOUT BUFFER PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8536I-33.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8536I-33 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 60mA = 207.9mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
If all outputs are loaded, the total power is 3 * 30mW = 90mW
Total Power
_MAX
(3.465V, with all outputs switching) = 207.9mW + 90mW = 297.9mW
2.
Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 86.7°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.298W * 86.7°C/W = 110.8°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-PIN TSSOP, FORCED CONVECTION
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
91.1°C/W
86.7°C/W
84.6°C/W
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相关代理商/技术参数 |
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| ICS8538BG-31LF | 功能描述:IC CLOCK BUFFER MUX 2:8 28-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS8538BG-31LFT | 功能描述:IC CLOCK BUFFER MUX 2:8 28-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS8538BGI-26LF | 功能描述:IC CLOCK BUFFER MUX 2:8 24-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS8538BGI26LFT | 制造商:Integrated Device Technology Inc 功能描述: |
| ICS8538BGI-26LFT | 功能描述:IC CLOCK BUFFER MUX 2:8 24-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
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