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| 型号： | ICS853S011BMILF |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 6/20页 |
| 文件大小： | 0K |
| 描述： | IC CLOCK BUFFER 1:2 2.5GHZ 8SOIC |
| 标准包装： | 97 |
| 系列： | HiPerClockS™ |
| 类型： | 扇出缓冲器（分配） |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:2 |
| 差分 - 输入:输出： | 是/是 |
| 输入： | CML，LVDS，LVPECL，SSTL |
| 输出： | ECL，LVPECL |
| 频率 - 最大： | 2.5GHz |
| 电源电压： | 2.375 V ~ 3.8 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
| 其它名称： | 800-2238 ICS853S011BMILF-ND |
ICS853S011BGI REVISION A MAY 12, 2010
14
2010 Integrated Device Technology, Inc.
ICS853S011BI Data Sheet
LOW SKEW, 1-TO-2, DIFFERENTIAL-TO-2.5V, 3.3V LVPECL/ECL FANOUT BUFFER
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS853S011BI.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS853S011BI is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC= 3.8V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.8V * 25mA = 95mW
Power (outputs)MAX = 29.86mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 29.86mW = 59.72mW
Total Power_MAX (3.3V, with all outputs switching) = 95mW + 59.72mW = 154.72mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 145.4°C/W per Table 5A below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.155W * 145.4°C/W = 107.5°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 5A. Thermal Resitance θJA for 8 Lead TSSOP, Forced Convection
Table 5A. Thermal Resitance θJA for 8 Lead SOIC, Forced Convection
θ
JA vs. Air Flow
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
145.4°C/W
141.3°C/W
139.3°C/W
θ
JA vs. Air Flow
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
102.0°C/W
95.0°C/W
90.6°C/W
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| ICS853S011BMILFT | 功能描述:IC CLOCK BUFFER 1:2 2.5GHZ 8SOIC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS853S011CGILF | 功能描述:IC CLK BUFFER 1:2 2.5GHZ 8-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS853S011CGILFT | 功能描述:IC CLK BUFFER 1:2 2.5GHZ 8-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS853S011CMILF | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 1:2 2.5GHZ 8SOIC |
| ICS853S011CMILFT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 1:2 2.5GHZ 8SOIC |
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