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参数资料
| 型号： | ICS854S006IT |
| 元件分类： | 时钟及定时 |
| 英文描述： | 854S SERIES, LOW SKEW CLOCK DRIVER, 6 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO24 |
| 封装： | 4.40 X 7.80 MM, 0.92 MM HEIGHT, MO-153, TSSOP-24 |
| 文件页数： | 2/14页 |
| 文件大小： | 1460K |
| 代理商： | ICS854S006IT |
IDT / ICS 1-TO-6 LVDS FANOUT BUFFER
10
ICS854S006I REV A JULY 24, 2006
ICS854S006I
LOW SKEW, 1-TO-6, DIFFERENTIAL-TO-LVDS FANOUT BUFFER
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS854S006I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS854S006I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)
MAX
= V
DD_MAX
* I
DD_MAX
= 3.465V * 45mA = 155.92mW
Power (outputs)
MAX
= V
DDO_MAX
* I
DDO_MAX
= 3.465V * 80mA = 277.2mW
Total Power
_MAX
= 155.92mW + 277.2mW = 433.12mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability
of the device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used.
Assuming no air flow and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.433W * 70°C/W = 115.3°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
24-LEAD TSSOP, FORCED CONVECTION
θθθθθ
JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65°C/W
62°C/W
相关PDF资料 |
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|---|---|
| ICS854S013ILFT | 854S SERIES, LOW SKEW CLOCK DRIVER, 3 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20 |
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| ICS854S013IT | 854S SERIES, LOW SKEW CLOCK DRIVER, 3 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20 |
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| ICS854S306AGI | 854S SERIES, LOW SKEW CLOCK DRIVER, 6 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO24 |
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| ICS854S015CKI-01LF | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER 24VFQFN |
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| ICS854S01AKILF | 功能描述:IC CLOCK MUX 2:1 2.5GHZ 16-QFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS854S036AKLFT | 功能描述:IC CLK BUFF 1:3/1:6 2GHZ 32VFQFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS854S057AGILF | 功能描述:IC CLOCK MUX 4:1 2GHZ 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
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