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| 型号： | ICS873995AYLFT |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 873995 SERIES, PLL BASED CLOCK DRIVER, 6 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48 |
| 封装： | 7 X 7 MM, 1 MM HEIGHT, ROHS COMPLIANT, MS-026, TQFP-48 |
| 文件页数： | 4/18页 |
| 文件大小： | 738K |
| 代理商： | ICS873995AYLFT |
IDT / ICS LVPECL ZERO DELAY/MULTIPLIER/DIVIDER
12
ICS873995AY REV. A JANUARY 8, 2007
ICS873995
DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY/MULTIPLIER/DIVIDER
V
CC - 2V
50
50
RTT
Z
o = 50
Z
o = 50
FOUT
FIN
RTT =
Z
o
1
((V
OH + VOL) / (VCC – 2)) – 2
3.3V
125
125
84
84
Z
o = 50
Z
o = 50
FOUT
FIN
The clock layout topology shown below is a typical termination
for LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, termi-
nating resistors (DC current path to ground) or current sources
must be used for functionality. These outputs are designed to
FIGURE 4B. LVPECL OUTPUT TERMINATION
FIGURE 4A. LVPECL OUTPUT TERMINATION
drive 50
transmission lines. Matched impedance techniques
should be used to maximize operating frequency and minimize
signal distortion.
Figures 4A and 4B show two different layouts
which are recommended only as guidelines. Other suitable clock
layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
TERMINATION FOR LVPECL OUTPUTS
EXPOSED PAD
Expose Metal Pad
(GROUND PAD)
GROUND PLANE
SOLDER
SIGNAL
TRACE
SIGNAL
TRACE
THERM AL VIA
SOLDER M ASK
FIGURE 5. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
THERMAL RELEASE PATH
The exposed metal pad provides heat transfer from the device to
the pc board. The exposed metal pad is a ground pad connected
to the ground plane through thermal via. The exposed pad on the
device to the exposed metal pad on the PCB is contacted through
solder as shown in
Figure 5. For further information, please refer
to Amkor Technology’s Application Note (dated December, 2001)
on
Surface Mount Assembly of Amkor’s Thermally /Electrically
Enhance Leadframe Base Packages.
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