参数资料
型号: ICS874S02BMILF
厂商: IDT, Integrated Device Technology Inc
文件页数: 5/16页
文件大小: 0K
描述: IC CLK GEN 1:1 DIFF ZD 20SOIC
标准包装: 37
系列: HiPerClockS™
类型: *
PLL: 带旁路
输入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
输出: LVDS
电路数: 1
比率 - 输入:输出: 1:1
差分 - 输入:输出: 是/是
频率 - 最大: 1GHz
除法器/乘法器: 是/是
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商设备封装: 20-SOIC
包装: 管件
ICS874S02I
1:1 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
IDT / ICS LVDS CLOCK GENERATOR
13
ICS874S02BMI REV. AOCTOBER 16, 2008
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS874S02I.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS874S02I is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
The maximum current at 85°C is as follows:
IDD_MAX = 93mA
IDDA_MAX = 19mA
IDDO_MAX = 36mA
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (93mA + 19mA) = 388.08mW
Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 36mA = 124.74mW
Total Power_MAX = 388.08mW + 124.74mW = 512.82mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 64.7°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.513W * 64.7°C/W = 118.2°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 7. Thermal Resistance θJA for 20 Lead SOIC, Forced Convection
θ
JA by Velocity
Linear Feet per Minute
0200
500
Multi-Layer PCB, JEDEC Standard Test Boards
64.7°C/W
56.7°C/W
53.5°C/W
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