参数资料
型号: IDT7008S35PF
厂商: IDT, Integrated Device Technology Inc
文件页数: 2/19页
文件大小: 0K
描述: IC SRAM 512KBIT 35NS 100TQFP
标准包装: 6
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,异步
存储容量: 512K (64K x 8)
速度: 35ns
接口: 并联
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 托盘
其它名称: 7008S35PF
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Description
The IDT7008 is a high-speed 64K x 8 Dual-Port Static RAM. The
IDT7008 is designed to be used as a stand-alone 512K-bit Dual-Port RAM
or as a combination MASTER/SLAVE Dual-Port RAM for 16-bit-or-more
word systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach
in 16-bit or wider memory system applications results in full-speed, error-
free operation without the need for additional discrete logic.
This device provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access for
Pin Configurations (1,2,3)
07/16/04
INDEX
Military, Industrial and Commercial Temperature Ranges
reads or writes to any location in memory. An automatic power down
feature controlled by the chip enables ( CE 0 and CE 1 ) permit the on-chip
circuitry of each port to enter a very low standby power mode.
Fabricated using IDT’s CMOS high-performance technology, these
devices typically operate on only 750mW of power.
The IDT7008 is packaged in a 84-pin Ceramic Pin Grid Array (PGA),
a 84-pin Plastic Leadless Chip Carrier (PLCC) and a 100-pin Thin Quad
Flatpack (TQFP).
A 6R
A 5R
A 4R
A 3R
A 2R
A 1R
A 0R
11 10 9
12
13
14
15
16
17
18
8 7
6 5
4 3
2 1 84 83 82 81 80 79 78 77 76 75
74
73
72
71
70
69
68
NC
I/O 7R
I/O 6R
I/O 5R
I/O 4R
I/O 3R
Vcc
INT R
BUSY R
M/ S
GND
BUSY L
INT L
NC
A 0L
A 1L
A 2L
A 3L
A 4L
A 5L
19
20
21
22
23
24
25
26
27
28
29
30
31
IDT7008J
J84-1 (4)
84-Pin PLCC
Top View (5)
67
66
65
64
63
62
61
60
59
58
57
56
55
I/O 2R
I/O 1R
I/O 0R
GND
Vcc
I/O 0L
I/O1 L
GND
I/O 2L
I/O 3L
I/O 4L
I/O 5L
I/O 6L
A 6L
32 54
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
I/O 7L
,
3198 drw 02
NOTES:
1. This text does not indicate orientation of the actual part marking.
2. All Vcc pins must be connected to power supply.
3. Package body is approximately 1.15 in x 1.15 in x .17 in.
4. This package code is used to reference the package diagram.
5. All GND pins must be connected to ground supply.
2
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