参数资料
型号: IDT71016S15PHGI8
厂商: IDT, Integrated Device Technology Inc
文件页数: 7/9页
文件大小: 0K
描述: IC SRAM 1MBIT 15NS 44TSOP
标准包装: 1
格式 - 存储器: RAM
存储器类型: SRAM - 异步
存储容量: 1M (64K x 16)
速度: 15ns
接口: 并联
电源电压: 4.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 44-TSOP(0.400",10.16mm 宽)
供应商设备封装: 44-TSOP II
包装: 标准包装
产品目录页面: 1256 (CN2011-ZH PDF)
其它名称: 800-1405-6
IDT71016, CMOS Static RAM
1 Meg (64K x 16-bit)
Commercial and Industrial Temperature Ranges
Timing Waveform of Write Cycle No. 2 ( CS Controlled Timing) (1,4)
t WC
ADDRESS
t AW
CS
t AS
t CW (2)
t BW
BHE , BLE
WE
DATA OUT
t WP
t DW
t WR
t DH
,
DATA IN
DATA IN VALID
3210 drw 9
Timing Waveform of Write Cycle No. 3 ( BHE , BLE Controlled Timing) (1,4)
t WC
ADDRESS
t AW
CS
t AS
t CW
(2)
t BW
BHE , BLE
WE
DATA OUT
t WP
t DW
t WR
t DH
DATA IN
DATA IN VALID
3210 drw 10
,
NOTES:
1. A write occurs during the overlap of a LOW CS , LOW BHE or BLE , and a LOW WE .
2. OE is continuously HIGH. If during a WE controlled write cycle OE is LOW, t WP must be greater than or equal to t WHZ + t DW to allow the I/O drivers to turn off and
data to be placed on the bus for the required t DW . If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the
minimum write pulse is as short as the specified t WP .
3. During this period, I/O pins are in the output state, and input signals must not be applied.
4. If the CS LOW or BHE and BLE LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state.
5. Transition is measured ±200mV from steady state.
7
6.42
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IDT71016S15PHI8 功能描述:IC SRAM 1MBIT 15NS 44TSOP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ
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IDT71016S15Y8 功能描述:IC SRAM 1MBIT 15NS 44SOJ RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ
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