参数资料
型号: IDT7143LA25PFI8
厂商: IDT, Integrated Device Technology Inc
文件页数: 11/17页
文件大小: 0K
描述: IC SRAM 32KBIT 25NS 100TQFP
标准包装: 750
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,异步
存储容量: 32K(2K x 16)
速度: 25ns
接口: 并联
电源电压: 4.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 带卷 (TR)
其它名称: 7143LA25PFI8
IDT7133SA/LA, IDT7143SA/LA
High-Speed 2K x 16 Dual-Port RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Write Cycle No. 1 (R/ W Controlled Timing) (1,5,8)
t WC
ADDRESS
OE
CE
t AS
(6)
t AW
t WR (3)
R/ W
(9)
t WP (2)
t HZ
(7)
DATA OUT
t LZ
(4)
t WZ (7)
t DW
t OW
t DH
(4)
t HZ (7)
DATA IN
2746 drw 09
Write Cycle No. 2 ( CE Controlled Timing) (1,5)
t WC
ADDRESS
t AW
CE
R/ W
(9)
t AS (6)
t EW (2)
t DW
t DH
t WR
DATA IN
2746 drw 10
NOTES:
1. R/ W or CE must be HIGH during all address transitions.
2. A write occurs during the overlap (t EW or t WP ) of a CE = V IL and a R/ W = V IL .
3. t WR is measured from the earlier of CE or R/ W going HIGH to the end of the write cycle.
4. During this period, the I/O pins are in the output state, and input signals must not be applied.
5. If the CE LOW transition occurs simultaneously with or after the R/ W LOW transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal ( CE or R/ W ) is asserted last.
7. Timing depends on which enable signal is de-asserted first, CE or OE .
8. If OE is LOW during a R/ W controlled write cycle, the write pulse width must be the larger of t WP or (t WZ + t DW ) to allow the I/O drivers to turn off and data to be placed
on the bus for the required t DW . If OE is HIGH during an R/ W controlled write cycle, this requirement does not apply and the write pulse can be as short as the
specified t WP .
9. R/ W for either upper or lower byte.
11
6.42
相关PDF资料
PDF描述
IDT71V67602S150PFG IC SRAM 9MBIT 150MHZ 100TQFP
IDT71V67602S133PFG IC SRAM 9MBIT 133MHZ 100TQFP
IDT71V65703S85BQI IC SRAM 9MBIT 85NS 165FBGA
IDT71V65703S85BQGI IC SRAM 9MBIT 85NS 165FBGA
IDT71V65703S80BQI IC SRAM 9MBIT 80NS 165FBGA
相关代理商/技术参数
参数描述
IDT7143LA35FB 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 32KBIT 35NS 68FPACK
IDT7143LA35G 功能描述:IC SRAM 32KBIT 35NS 68PGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
IDT7143LA35GB 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 32KBIT 35NS 68PGA
IDT7143LA35J 功能描述:IC SRAM 32KBIT 35NS 68PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI
IDT7143LA35J8 功能描述:IC SRAM 32KBIT 35NS 68PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI