参数资料
型号: IDT71V3556S133PFG8
厂商: IDT, Integrated Device Technology Inc
文件页数: 6/28页
文件大小: 0K
描述: IC SRAM 4MBIT 133MHZ 100TQFP
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: SRAM - 同步 ZBT
存储容量: 4.5M(128K x 36)
速度: 133MHz
接口: 并联
电源电压: 3.135 V ~ 3.465 V
工作温度: 0°C ~ 70°C
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 带卷 (TR)
其它名称: 71V3556S133PFG8
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with
ZBT ? Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Pin Configuration - 256K x 18
Absolute Maximum Ratings
(1)
Symbol
Rating
Commercial &
Industrial Values
Unit
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
V TERM (2)
Terminal Voltage with
Respect to GND
-0.5 to +4.6
V
NC
NC
1
2
80
79
A 10
NC
V TERM (3,6)
Terminal Voltage with
-0.5 to V DD
V
NC
V DDQ
3
4
78
77
NC
V DDQ
Respect to GND
V SS
NC
NC
I/O 8
I/O 9
V SS
V DDQ
5
6
7
8
9
10
11
76
75
74
73
72
71
70
V SS
NC
I/O P1
I/O 7
I/O 6
V SS
V DDQ
V TERM (4,6)
V TERM (5,6)
Terminal Voltage with
Respect to GND
Terminal Voltage with
Respect to GND
-0.5 to V DD +0.5
-0.5 to V DDQ +0.5
V
V
I/O 10
I/O 11
V DD (1)
V DD
V DD (1)
V SS
12
13
14
15
16
17
69
68
67
66
65
64
I/O 5
I/O 4
V SS
V DD (1)
V DD
V SS /ZZ (3)
T A
(7)
Commercial
Operating Temperature
Industrial
-0 to +70
-40 to +85
o
o
C
C
I/O 12
I/O 13
18
19
63
62
I/O 3
I/O 2
Operating Temperature
V DDQ
V SS
I/O 14
20
21
22
61
60
59
V DDQ
V SS
I/O 1
T BIAS
Temperature
Under Bias
-55 to +125
o
C
I/O 15
23
58
I/O 0
C
I/O P2
NC
V SS
V DDQ
NC
NC
24
25
26
27
28
29
57
56
55
54
53
52
NC
NC
V SS
V DDQ
NC
NC
,
T STG
P T
Storage
Temperature
Power Dissipation
-55 to +125
2.0
o
W
NC
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
51
NC
I OUT
DC Output Current
50
mA
5281 drw 02a
NOTES:
5281 tbl 06
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
Top View
100 TQFP
NOTES:
1. Pins 14, 16 and 66 do not have to be connected directly to V DD as long as the
input voltage is ≥ V IH .
2. Pins 83 and 84 are reserved for future 8M and 16M respectively.
3. Pin 64 does not have to be connected directly to V SS as long as the input
voltage is ≤ V IL ; on the latest die revision this pin supports ZZ (sleep mode).
100 Pin TQFP Capacitance (1)
(T A = +25° C, f = 1.0MHz)
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2. V DD terminals only.
3. V DDQ terminals only.
4. Input terminals only.
5. I/O terminals only.
6. This is a steady-state DC parameter that applies after the power supply has
reached its nominal operating value. Power sequencing is not necessary; however,
the voltage on any input or I/O pin cannot exceed V DDQ during power supply ramp
up.
7. T A is the "instant on" case temperature.
119 BGA Capacitance (1)
(T A = +25° C, f = 1.0MHz)
Symbol
C IN
C I/O
Parameter (1)
Input Capacitance
I/O Capacitance
Conditions
V IN = 3dV
V OUT = 3dV
Max.
5
7
Unit
pF
pF
Symbol
C IN
C I/O
Parameter (1)
Input Capacitance
I/O Capacitance
Conditions
V IN = 3dV
V OUT = 3dV
Max.
7
7
Unit
pF
pF
165 fBGA Capacitance (1)
(T A = +25° C, f = 1.0MHz)
5281 tbl 07
5281 tbl 07a
Symbol
C IN
C I/O
Parameter (1)
Input Capacitance
I/O Capacitance
Conditions
V IN = 3dV
V OUT = 3dV
Max.
TBD
TBD
Unit
pF
pF
NOTE:
5281 tbl 07b
1. This parameter is guaranteed by device characterization, but not production tested.
6.42
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