参数资料
型号: IDT71V3556SA133BGGI8
厂商: IDT, Integrated Device Technology Inc
文件页数: 10/28页
文件大小: 0K
描述: IC SRAM 4MBIT 133MHZ 119BGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: SRAM - 同步 ZBT
存储容量: 4.5M(128K x 36)
速度: 133MHz
接口: 并联
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
封装/外壳: 119-BGA
供应商设备封装: 119-PBGA(14x22)
包装: 带卷 (TR)
其它名称: 71V3556SA133BGGI8
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with
ZBT ? Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Interleaved Burst Sequence Table ( LBO =V DD )
Sequence 1
Sequence 2
Sequence 3
Sequence 4
A1
A0
A1
A0
A1
A0
A1
A0
First Address
Second Address
Third Address
Fourth Address (1)
0
0
1
1
0
1
0
1
0
0
1
1
1
0
1
0
1
1
0
0
0
1
0
1
1
1
0
0
1
0
1
0
NOTE:
1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting.
Linear Burst Sequence Table ( LBO =V SS )
5281 tbl 10
Sequence 1
Sequence 2
Sequence 3
Sequence 4
A1
A0
A1
A0
A1
A0
A1
A0
First Address
Second Address
Third Address
0
0
1
0
1
0
0
1
1
1
0
1
1
1
0
0
1
0
1
0
0
1
0
1
Fourth Address
(1)
1
1
0
0
0
1
1
0
NOTE:
1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting.
5281 tbl 11
Functional Timing Diagram
(1)
CYCLE
n+29
n+30
n+31
n+32
n+33
n+34
n+35
n+36
n+37
CLOCK
(2)
ADDRESS
(A0 - A16)
(2)
CONTROL
(R/ W , ADV/ LD , BW x)
A29
C29
A30
C30
A31
C31
A32
C32
A33
C33
A34
C34
A35
C35
A36
C36
A37
C37
(2)
DATA
I/O [0:31], I/O P[1:4]
NOTES:
D/Q27
D/Q28
D/Q29
D/Q30
D/Q31
D/Q32
D/Q33
D/Q34
D/Q35
5281 drw 03
,
1. This assumes CEN , CE 1 , CE 2 , CE 2 are all true.
2. All Address, Control and Data_In are only required to meet set-up and hold time with respect to the rising edge of clock. Data_Out is valid after a clock-to-data delay
from the rising edge of clock.
10
6.42
相关PDF资料
PDF描述
AMC65DRTF CONN EDGECARD 130PS .100 DIP SLD
ASC65DREF CONN EDGECARD 130POS .100 EYELET
IDT71V3556SA100BGGI8 IC SRAM 4MBIT 100MHZ 119BGA
AMC65DREF CONN EDGECARD 130PS .100 EYELET
ASC65DREH-S734 CONN EDGECARD 130POS .100 EYELET
相关代理商/技术参数
参数描述
IDT71V3556SA133BGI 功能描述:IC SRAM 4MBIT 133MHZ 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V3556SA133BGI8 功能描述:IC SRAM 4MBIT 133MHZ 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V3556SA133BQ 功能描述:IC SRAM 4MBIT 133MHZ 165FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V3556SA133BQ8 功能描述:IC SRAM 4MBIT 133MHZ 165FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
IDT71V3556SA133BQG 功能描述:IC SRAM 4MBIT 133MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)