参数资料
型号: IDT71V65803S150PFI8
厂商: IDT, Integrated Device Technology Inc
文件页数: 9/26页
文件大小: 0K
描述: IC SRAM 9MBIT 150MHZ 100TQFP
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: SRAM - 同步 ZBT
存储容量: 9M(512K x 18)
速度: 150MHz
接口: 并联
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 带卷 (TR)
其它名称: 71V65803S150PFI8
IDT71V65603, IDT71V65803, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
ZBT ? Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Synchronous Truth Table (1)
CEN
L
L
L
L
L
L
H
R/ W
L
H
X
X
X
X
X
Chip (5)
Enable
Select
Select
X
X
Deselect
X
X
ADV/ LD
L
L
H
H
L
H
X
BW x
Valid
X
Valid
X
X
X
X
ADDRESS
USED
External
External
Internal
Internal
X
X
X
PREVIOUS CYCLE
X
X
LOAD WRITE /
BURST WRITE
LOAD READ /
BURST READ
X
DESELECT / NOOP
X
CURRENT CYCLE
LOAD WRITE
LOAD READ
BURST WRITE
(Advance burst counter) (2)
BURST READ
(Advance burst counter) (2)
DESELECT or STOP (3)
NOOP
SUSPEND (4)
I/O
(2 cycles later)
D (7)
Q (7)
D (7)
Q (7)
HiZ
HiZ
Previous Value
NOTES:
5304 tbl 08
1. L = V IL , H = V IH , X = Don’t Care.
2. When ADV/ LD signal is sampled high, the internal burst counter is incremented. The R/ W signal is ignored when the counter is advanced. Therefore the nature of
the burst cycle (Read or Write) is determined by the status of the R/ W signal when the first address is loaded at the beginning of the burst cycle.
3. Deselect cycle is initiated when either ( CE 1 , or CE 2 is sampled high or CE 2 is sampled low) and ADV/ LD is sampled low at rising edge of clock. The data bus will
tri-state two cycles after deselect is initiated.
4. When CEN is sampled high at the rising edge of clock, that clock edge is blocked from propogating through the part. The state of all the internal registers and the I/
Os remains unchanged.
5. To select the chip requires CE 1 = L, CE 2 = L, CE 2 = H on these chip enables. Chip is deselected if any one of the chip enables is false.
6. Device Outputs are ensured to be in High-Z after the first rising edge of clock upon power-up.
7. Q - Data read from the device, D - data written to the device.
Partial Truth Table for Writes (1)
READ
WRITE ALL BYTES
OPERATION
R/ W
H
L
BW 1
X
L
BW 2
X
L
BW 3 (3)
X
L
BW 4 (3)
X
L
WRITE BYTE 1 (I/O[0:7], I/O P1 )
(2)
L
L
H
H
H
WRITE BYTE 4 (I/O[24:31], I/O P4 )
WRITE BYTE 2 (I/O[8:15], I/O P2 ) (2)
WRITE BYTE 3 (I/O[16:23], I/O P3 ) (2,3)
(2,3)
NO WRITE
L
L
L
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
NOTES:
1. L = V IL , H = V IH , X = Don’t Care.
2. Multiple bytes may be selected during the same cycle.
3. N/A for X18 configuration.
9
6.42
5304 tbl 09
相关PDF资料
PDF描述
ISL9008AIRUFZ-T IC REG LDO 2.5V .15A 6-UTDFN
ISL9008AIRUCZ-T IC REG LDO 1.8V .15A 6-UTDFN
IDT71V65803S150PFI IC SRAM 9MBIT 150MHZ 100TQFP
ISL9008AIRUBZ-T IC REG LDO 1.5V .15A 6-UTDFN
TC7135CBU IC ADC 4 1/2DGT 64-MQFP
相关代理商/技术参数
参数描述
IDT71V65903S80BG 功能描述:IC SRAM 9MBIT 80NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI
IDT71V65903S80BG8 功能描述:IC SRAM 9MBIT 80NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI
IDT71V65903S80BGI 功能描述:IC SRAM 9MBIT 80NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:45 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,异步 存储容量:128K(8K x 16) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:70V25S15PF
IDT71V65903S80BGI8 功能描述:IC SRAM 9MBIT 80NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI
IDT71V65903S80BQ 功能描述:IC SRAM 9MBIT 80NS 165FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI