参数资料
型号: IDT7200L20TP
厂商: IDT, Integrated Device Technology Inc
文件页数: 14/14页
文件大小: 0K
描述: IC MEM FIFO 256X9 20NS 28-PDIP
标准包装: 14
系列: 7200
功能: 异步
存储容量: 2.3K(256 x 9)
数据速率: 33.3MHz
访问时间: 20ns
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 通孔
封装/外壳: 28-DIP(0.300",7.62mm)
供应商设备封装: 28-PDIP
包装: 管件
其它名称: 7200L20TP
9
COMMERCIAL,INDUSTRIALANDMILITARY
TEMPERATURERANGES
IDT7201L/7201LA/7202LA CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
Figure 9. Half-Full Flag Timing
Figure 10. Expansion Out
Figure 11. Expansion In
OPERATING MODES:
Care must be taken to assure that the appropriate flag is monitored by
eachsystem(i.e.FFismonitoredonthedevicewhereWisused;EFismonitored
onthedevicewhereR isused).Foradditionalinformation,refertoTechNote
8: Operating FIFOs on Full and Empty Boundary Conditions and Tech Note
6: Designing with FIFOs.
SINGLE DEVICE MODE
A single IDT7200/7201A/7202A may be used when the application
requirements are for 256/512/1,024 words or less. These devices are in a
Single Device Configuration when the Expansion In (XI) control input is
grounded (see Figure 12).
DEPTH EXPANSION
The IDT7200/7201A/7202A can easily be adapted to applications when
the requirements are for greater than 256/512/1,024 words. Figure 14
demonstrates Depth Expansion using three IDT7200/7201A/7202As. Any
depthcanbeattainedbyaddingadditionalIDT7200/7201A/7202As. These
FIFOs operate in the Depth Expansion mode when the following conditions
are met:
1. ThefirstdevicemustbedesignatedbygroundingtheFirstLoad(FL)control
input.
2. All other devices must have FL in the HIGH state.
3. TheExpansionOut(XO)pinofeachdevicemustbetiedtotheExpansion
In (XI) pin of the next device. See Figure 14.
4. ExternallogicisneededtogenerateacompositeFullFlag(FF)andEmpty
Flag (EF). This requires the ORing of all EFs and ORing of all FFs (i.e.
all must be set to generate the correct composite FF or EF). See Figure
14.
5. TheRetransmit(RT)functionandHalf-FullFlag(HF)arenotavailablein
the Depth Expansion Mode.
For additional information, refer to Tech Note 9: Cascading FIFOs or
FIFO Modules.
R
W
HF
tRHF
HALF-FULL OR LESS
MORE THAN HALF-FULL
tWHF
2679 drw 11
HALF-FULL OR LESS
R
W
XO
2679 drw 12
WRITE TO
LAST PHYSICAL
LOCATION
tXOL
tXOH
READ FROM
LAST PHYSICAL
LOCATION
tXOL
tXOH
W
R
XI
WRITE TO
FIRST PHYSICAL
LOCATION
tXIS
READ FROM
FIRST PHYSICAL
LOCATION
tXIS
tXI
tXIR
2679 drw 13
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IDT7200L25J8 功能描述:IC MEM FIFO 256X9 25NS 32-PLCC RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:80 系列:7200 功能:同步 存储容量:18.4K(1K x 18) 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP(10x10) 包装:托盘 其它名称:72225LB10TF
IDT7200L25JI 功能描述:IC MEM FIFO 256X9 25NS 32-PLCC RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:80 系列:7200 功能:同步 存储容量:18.4K(1K x 18) 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP(10x10) 包装:托盘 其它名称:72225LB10TF
IDT7200L25JI8 功能描述:IC MEM FIFO 256X9 25NS 32-PLCC RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:80 系列:7200 功能:同步 存储容量:18.4K(1K x 18) 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP(10x10) 包装:托盘 其它名称:72225LB10TF
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