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参数资料
| 型号： | IDT7206L25P |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 14/14页 |
| 文件大小： | 0K |
| 描述： | IC FIFO 8192X18 25NS 28DIP |
| 标准包装： | 13 |
| 系列： | 7200 |
| 功能： | 异步 |
| 存储容量： | 144K（16K x 9） |
| 数据速率： | 28.5MHz |
| 访问时间： | 25ns |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 28-DIP（0.600"，15.24mm） |
| 供应商设备封装： | 28-PDIP |
| 包装： | 管件 |
| 其它名称： | 7206L25P |
9
COMMERCIAL,INDUSTRIALANDMILITARY
TEMPERATURERANGES
IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO
2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9
Figure 9. Half-Full Flag Timing
Figure 10. Expansion Out
Figure 11. Expansion In
OPERATING MODES:
Care must be taken to assure that the appropriate flag is monitored by
eachsystem(i.e.FFismonitoredonthedevicewhereWisused;EFismonitored
onthedevicewhereRisused).ForadditionalinformationontheIDT7203/7204/
7205/7206/7207, refer to Tech Note 8: Operating FIFOs on Full and Empty
Boundary Conditions and Tech Note 6: Designing with FIFOs.
Single Device Mode
A single IDT7203/7204/7205/7206/7207/7208 may be used when the
applicationrequirementsarefor2,048/4,096/8,192/16,384/32,768/65,536words
or less. These FIFOs are in a Single Device Configuration when the Expansion
In (XI) control input is grounded (see Figure 12).
Depth Expansion
These FIFOs can easily be adapted to applications when the require-
mentsareforgreaterthan2,048/4,096/8,192/16,384/32,768/65,536words.
Figure 14 demonstrates Depth Expansion using three IDT7203/7204/7205/
7206/7207/7208s. AnydepthcanbeattainedbyaddingadditionalIDT7203/
7204/7205/7206/7207/7208s. ThesedevicesoperateintheDepthExpansion
modewhenthefollowingconditionsaremet:
1. ThefirstdevicemustbedesignatedbygroundingtheFirstLoad(FL)control
input.
2. All other devices must have FLin the HIGH state.
3. TheExpansionOut(XO)pinofeachdevicemustbetiedtotheExpansion
In (XI) pin of the next device. See Figure 14.
4. ExternallogicisneededtogenerateacompositeFullFlag(FF)andEmpty
Flag (EF). This requires the ORing of all EFs and ORing of all FFs (i.e. all
must be set to generate the correct composite FFor EF). See Figure 14.
5. The Retransmit (RT) function and Half-Full Flag (HF) are not available in
the Depth Expansion Mode.
For additional information on the IDT7203/7204/7205/7206/7207, refer to
Tech Note 9: Cascading FIFOs or FIFO Modules.
W
R
HF
HALF-FULL OR LESS
MORE THAN HALF-FULL
HALF-FULL OR LESS
tRHF
tWHF
2661 drw11
W
R
XO
WRITE TO
LAST PHYSICAL
LOCATION
tXOL
tXOH
READ FROM
LAST PHYSICAL
LOCATION
2661 drw12
tXOH
tXOL
W
R
XI
WRITE TO
FIRST PHYSICAL
LOCATION
READ FROM
FIRST PHYSICAL
LOCATION
tXI
tXIR
2661 drw13
tXIS
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| IDT7206L25TP | IC FIFO 8192X18 25NS 28DIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT7206L25PI | 功能描述:IC FIFO 8192X18 25NS 28DIP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:90 系列:7200 功能:同步 存储容量:288K（16K x 18） 数据速率:100MHz 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（14x14） 包装:托盘 其它名称:72271LA10PF |
| IDT7206L25TP | 功能描述:IC FIFO 8192X18 25NS 28DIP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:90 系列:7200 功能:同步 存储容量:288K（16K x 18） 数据速率:100MHz 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（14x14） 包装:托盘 其它名称:72271LA10PF |
| IDT7206L25TPI | 功能描述:IC FIFO 8192X18 25NS 28DIP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:90 系列:7200 功能:同步 存储容量:288K（16K x 18） 数据速率:100MHz 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（14x14） 包装:托盘 其它名称:72271LA10PF |
| IDT7206L30DB | 制造商:Integrated Device Technology Inc 功能描述:IC MEM FIFO 16K X 9 ASYNC 28CDIP |
| IDT7206L30LB | 制造商:Integrated Device Technology Inc 功能描述:IC MEM FIFO 16K X 9 ASYNC 32LCC |
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