参数资料
型号: IDT72211L25PF8
厂商: IDT, Integrated Device Technology Inc
文件页数: 3/14页
文件大小: 0K
描述: IC FIFO 512X9 SYNC 25NS 32-TQFP
标准包装: 2,000
系列: 7200
功能: 同步
存储容量: 4.6K(512 x 9)
访问时间: 25ns
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 32-LQFP
供应商设备封装: 32-TQFP(7x7)
包装: 带卷 (TR)
其它名称: 72211L25PF8
11
COMMERCIALANDINDUSTRIAL
TEMPERATURERANGES
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9
Figure 11. Programmable Empty Flag Timing
NOTES:
1. n = PAE offset.
2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge for PAE to change during that clock cycle. If the time between the rising edge of WCLK and
the rising edge of RCLK is less than tSKEW2, then PAE may not change state until the next RCLK rising edge.
3. If a read is performed on this rising edge of the Read Clock, there will be Empty + (n-1) words in the FIFO when PAE goes LOW.
NOTES:
1. m = PAF offset .
2. 64-m words in FIFO for IDT72421, 256-m words for IDT72201, 512-m words for IDT72211, 1,024-m words for IDT72221, 2,048-m words for IDT72231, 4,096-m words for IDT72241,
and 8,192-m words for IDT72251.
3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge for PAF to change during that clock cycle. If the time between the rising edge of RCLK and
the rising edge of WCLK is less than tSKEW2, then PAF may not change state until the next WCLK rising edge.
4. If a write is performed on this rising edge of the Write Clock, there will be Full - (m-1) words in the FIFO when PAF goes LOW.
Figure 10. Programmable Full Flag Timing
tENS
tENH
tENS
tENH
tENS
tENH
WCLK
WEN1
WEN2
(If Applicable)
PAF
RCLK
REN1,
REN2
(4)
(1)
tPAF
Full - (m+1) words in FIFO
Full - m words in FIFO
(2)
tCLKH
tCLKL
tSKEW2
(3)
tPAF
2655 drw 12
WCLK
WEN1
WEN2
PAE
RCLK
REN1,
REN2
tENS
tENH
tENS
tENH
tSKEW2
(2)
tENS
tENH
(If Applicable)
tPAE
(3)
(1)
n words in FIFO
n+1 words in FIFO
tCLKH
tCLKL
2655 drw 13
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