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参数资料
| 型号： | IDT72215LB15PFGI8 |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | IC FIFO 512X18 SYNC 15NS 64-TQFP |
| 标准包装： | 750 |
| 系列： | 7200 |
| 功能： | 同步 |
| 存储容量： | 9.2K（512 x 18） |
| 数据速率： | 67MHz |
| 访问时间： | 15ns |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-LQFP |
| 供应商设备封装： | 64-TQFP（14x14） |
| 包装： | 带卷 (TR) |
| 其它名称： | 72215LB15PFGI8 |
3
IDT72205LB/72215LB/72225LB/72235LB/72245LB CMOS SyncFIFOTM
256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18 and 4,096 x 18
COMMERCIALANDINDUSTRIAL
TEMPERATURERANGES
MARCH 2013
PIN DESCRIPTION
Symbol
Name
I/O
Description
D0–D17
DataInputs
I
Data inputs for a 18-bit bus.
RS
Reset
I
WhenRS issetLOW,internalreadandwritepointersaresettothefirstlocationoftheRAMarray,FFand PAF
go HIGH, and PAE and EF go LOW. A reset is required before an initial WRITE after power-up.
WCLK
WriteClock
I
WhenWENisLOW,dataiswrittenintotheFIFOonaLOW-to-HIGHtransitionofWCLK,iftheFIFOisnotfull.
WEN
WriteEnable
I
When WEN is LOW and LD is HIGH, data is written into the FIFO on every LOW-to-HIGH transition of
WCLK. When WEN is HIGH, the FIFO holds the previous data. Data will not be written into the FIFO if the FF
isLOW.
RCLK
Read Clock
I
WhenRENisLOW,dataisreadfromtheFIFOonaLOW-to-HIGHtransitionofRCLK,iftheFIFOisnotempty.
REN
Read Enable
I
When REN is LOW, and LD is HIGH, data is read from the FIFO on every LOW-to-HIGH transition of RCLK.
When REN is HIGH, the output register holds the previous data. Data will not be read from the FIFO if the EF
isLOW.
OE
OutputEnable
I
WhenOEisLOW,thedataoutputbusisactive.IfOE isHIGH,theoutputdatabuswillbeinahigh-impedance
state.
LD
Load
I
When LDisLOW,dataontheinputsD0–D11iswrittentotheoffsetanddepthregistersontheLOW-to-HIGH
transition of the WCLK, when WEN is LOW. When LD is LOW, data on the outputs Q0–Q11 is read from the
offset and depth registers on the LOW-to-HIGH transition of the RCLK, when REN is LOW.
FL
FirstLoad
I
Inthesingledeviceorwidthexpansionconfiguration,FLisgrounded.Inthedepthexpansionconfiguration,FL
is grounded on the first device (first load device) and set to HIGH for all other devices in the Daisy Chain.
WXI
WriteExpansion
I
Inthesingledeviceorwidthexpansionconfiguration,WXI isgrounded.Inthedepthexpansionconfiguration,
WXI is connected to WXO (Write Expansion Out) of the previous device.
RXI
Read Expansion
I
Inthesingledeviceorwidthexpansionconfiguration, RXI isgrounded.Inthedepthexpansionconfiguration,
RXI is connected to RXO (Read Expansion Out) of the previous device.
FF
Full Flag
O
WhenFFisLOW,theFIFOisfullandfurtherdatawritesintotheinputareinhibited.WhenFFisHIGH,theFIFO
is not full. FF is synchronized to WCLK.
EF
EmptyFlag
O
WhenEFisLOW,theFIFOisemptyandfurtherdatareadsfromtheoutputareinhibited.WhenEFisHIGH,the
FIFO is not empty. EF is synchronized to RCLK.
PAE
Programmable
O
When PAE is LOW, the FIFO is almost empty based on the offset programmed into the FIFO. The default
Almost-EmptyFlag
offset at reset is 31 from empty for IDT72205LB, 63 from empty for IDT72215LB, and 127 from empty for
IDT72225LB/72235LB/72245LB.
PAF
Programmable
O
WhenPAFisLOW,theFIFOisalmost-fullbasedontheoffsetprogrammedintotheFIFO.Thedefaultoffsetat
Almost-FullFlag
reset is 31 from full for IDT72205, 63 from full for IDT72215LB, and 127 from full for IDT72225LB/72235LB/
72245LB.
WXO/HF
WriteExpansion
O
In the single device or width expansion configuration, the device is more than half full when HF is LOW. In the
Out/Half-FullFlag
depthexpansionconfiguration,apulseissentfromWXOtoWXIofthenextdevicewhenthelastlocationinthe
FIFOiswritten.
RXO
Read Expansion
O
In the depth expansion configuration, a pulse is sent from RXO to RXI of the next device when the last
Out
location in the FIFO is read.
Q0–Q17
DataOutputs
O
Data outputs for an 18-bit bus.
VCC
Power
+5V power supply pins.
GND
Ground
Eight ground pins for the PLCC and seven gound pins for the TQFP/STQFP.
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相关代理商/技术参数 |
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| IDT72215LB15PFI | 功能描述:IC FIFO 512X18 SYNC 15NS 64-TQFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
| IDT72215LB15PFI8 | 功能描述:IC FIFO 512X18 SYNC 15NS 64-TQFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
| IDT72215LB15TF | 功能描述:IC FIFO 512X18 SYNC 15NS 64QFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
| IDT72215LB15TF8 | 功能描述:IC FIFO 512X18 SYNC 15NS 64QFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
| IDT72215LB15TFI | 功能描述:IC FIFO 512X18 SYNC 15NS 64QFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:7200 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
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