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参数资料
| 型号： | IDT72V02L25J |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | IC FIFO ASYNCH 1KX9 25NS 32PLCC |
| 标准包装： | 32 |
| 系列： | 72V |
| 功能： | 异步 |
| 存储容量： | 9K（1K x 9） |
| 访问时间： | 25ns |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-LCC（J 形引线） |
| 供应商设备封装： | 32-PLCC（13.97x11.43） |
| 包装： | 管件 |
| 其它名称： | 72V02L25J |
8
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO
512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9
OPERATING MODES:
Caremustbetakentoassurethattheappropriateflagismonitoredbyeach
system (i.e. FFis monitored on the device where Wis used; EFis monitored
onthedevicewhereRisused).Foradditionalinformation,refertoTechNote
8: Operating FIFOs on Full and Empty Boundary Conditions and Tech Note
6: Designing with FIFOs.
SINGLE DEVICE MODE
A single IDT72V01/72V02/72V03/72V04/72V05/72V06 may be used
when the application requirements are for 512/1,024/2,048/4,096/8,192/
16,384wordsorless.ThesedevicesareinaSingleDeviceConfigurationwhen
the Expansion In ( XI) control input is grounded (see Figure 12).
TheseFIFOscaneasilybeadaptedtoapplicationswhentherequirements
are for greater than 512/1,024/2,048/4,096/8,192/16,384 words. Figure 14
demonstratesDepthExpansionusingthreeIDT72V01/72V02/72V03/72V04/
72V05/72V06s. Any depth can be attained by adding additional IDT72V01/
72V02/72V03/72V04/72V05/72V06s. These devices operate in the Depth
Expansionmodewhenthefollowingconditionsaremet:
1. ThefirstdevicemustbedesignatedbygroundingtheFirstLoad(FL)control
input.
2. All other devices must have FLin the HIGH state.
3. TheExpansionOut(XO)pinofeachdevicemustbetiedtotheExpansion
In ( XI ) pin of the next device. See Figure 14.
4. ExternallogicisneededtogenerateacompositeFullFlag(FF)andEmpty
Flag ( EF). This requires the ORing of all EFs and ORing of all FFs (i.e.
allmustbesettogeneratethecorrectcompositeFForEF). SeeFigure14.
5. The Retransmit ( RT) function and Half-Full Flag ( HF) are not available
in the Depth Expansion Mode.
Foradditionalinformation,refertoTechNote9: CascadingFIFOsorFIFO
Modules.
USAGE MODES:
WIDTH EXPANSION
Wordwidthmaybeincreasedsimplybyconnectingthecorrespondinginput
controlsignalsofmultipledevices. Statusflags(EF,FFandHF)canbedetected
from any one device. Figure 13 demonstrates an 18-bit word width by using
twoIDT72V01/72V02/72V03/72V04/72V05/72V06s. Anywordwidthcanbe
attainedbyaddingadditionalIDT72V01/72V02/72V03/72V04/72V05/72V06s
(Figure 13).
BIDIRECTIONAL OPERATION
Applications which require data buffering between two systems (each
system capable of Read and Write operations) can be achieved by pairing
IDT72V01/72V02/72V03/72V04/72V05/72V06sasshowninFigure16.Both
Depth Expansion and Width Expansion may be used in this mode.
DATAFLOW-THROUGH
Twotypesofflow-throughmodesarepermitted,areadflow-throughand
writeflow-throughmode. Forthereadflow-throughmode(Figure17),theFIFO
permitsareadingofasinglewordafterwritingonewordofdataintoanempty
FIFO. The data is enabled on the bus in (tWEF + tA) ns after the rising edge of
W,calledthefirstwriteedge,anditremainsonthebusuntilthe Rlineisraised
fromLOW-to-HIGH,afterwhichthebuswouldgointoathree-statemodeafter
tRHZ ns. The EFline would have a pulse showing temporary deassertion and
then would be asserted.
Inthewriteflow-throughmode(Figure18),theFIFOpermitsthewritingof
asinglewordofdataimmediatelyafterreadingonewordofdatafromafullFIFO.
The Rline causes the FFto be deasserted but the Wline being LOW causes
it to be asserted again in anticipation of a new data word. On the rising edge
ofW,thenewwordisloadedintheFIFO.TheWlinemustbetoggledwhenFF
isnotassertedtowritenewdataintheFIFOandtoincrementthewritepointer.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT72V02L25J8 | 功能描述:IC FIFO ASYNCH 1KX9 25NS 32PLCC RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
| IDT72V02L25JGI | 功能描述:IC FIFO ASYNCH 1KX9 25NS 32PLCC RoHS:是 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
| IDT72V02L25JGI8 | 功能描述:IC FIFO ASYNCH 1KX9 25NS 32PLCC RoHS:是 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
| IDT72V02L25JI | 功能描述:IC FIFO ASYNCH 1KX9 25NS 32PLCC RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
| IDT72V02L25JI8 | 功能描述:IC FIFO ASYNCH 1KX9 25NS 32PLCC RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:80 系列:7200 功能:同步 存储容量:18.4K（1K x 18） 数据速率:- 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（10x10） 包装:托盘 其它名称:72225LB10TF |
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