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参数资料
| 型号： | IDT72V255LA20PF8 |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 18/27页 |
| 文件大小： | 0K |
| 描述： | IC FIFO SS 8192X18 20NS 64-TQFP |
| 标准包装： | 750 |
| 系列： | 72V |
| 功能： | 同步 |
| 存储容量： | 144K（8K x 18） |
| 访问时间： | 20ns |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-LQFP |
| 供应商设备封装： | 64-TQFP（14x14） |
| 包装： | 带卷 (TR) |
| 其它名称： | 72V255LA20PF8 |
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25
IDT72V255LA/72V265LA 3.3 VOLT CMOS SuperSync FIFO
8,192 x 18, 16,384 x 18
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
OCTOBER 22, 2008
Figure 20. Block Diagram of 16,384 x 18 and 32,768 x 18 Depth Expansion
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72V255LA can easily be adapted to applications requiring depths
greater than 8,192 and 16,384 for the IDT72V265LA with an 18-bit bus
width. In FWFT mode, the FIFOs can be connected in series (the data
outputs of one FIFO connected to the data inputs of the next) with no
external logic necessary. The resulting configuration provides a total
depth equivalent to the sum of the depths associated with each single
FIFO. Figure 24 shows a depth expansion using two IDT72V255LA/
72V265LA devices.
Care should be taken to select FWFT mode during Master Reset for all
FIFOs in the depth expansion configuration. The first word written to an
empty configuration will pass from one FIFO to the next ("ripple down")
until it finally appears at the outputs of the last FIFO in the chain–no read
operation is necessary but the RCLK of each FIFO must be free-running.
Each time the data word appears at the outputs of one FIFO, that device's
OR line goes LOW, enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for
OR
of the last FIFO in the chain to go LOW (i.e. valid data to appear on the last
FIFO's outputs) after a word has been written to the first FIFO is the sum of
the delays for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
where N is the number of FIFOs in the expansion and TRCLK is the
RCLK period. Note that extra cycles should be added for the possibility
that the tSKEW3 specification is not met between WCLK and transfer clock,
or RCLK and transfer clock, for the
OR flag.
The "ripple down" delay is only noticeable for the first word written to an
empty depth expansion configuration. There will be no delay evident for
subsequent words written to the configuration.
The first free location created by reading from a full depth expansion
configuration will "bubble up" from the last FIFO to the previous one until it
finally moves into the first FIFO of the chain. Each time a free location is
created in one FIFO of the chain, that FIFO's
IR line goes LOW, enabling
the preceding FIFO to write a word to fill it.
For a full expansion configuration, the amount of time it takes for
IR of the
first FIFO in the chain to go LOW after a word has been read from the last
FIFO is the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the
WCLK period. Note that extra cycles should be added for the possibility
that the tSKEW1 specification is not met between RCLK and transfer clock,
or WCLK and transfer clock, for the
IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK, which-
ever is faster. Both these actions result in data moving, as quickly as
possible, to the end of the chain and free locations to the beginning of the
chain.
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE
OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
IDT
72V255LA
72V265LA
TRANSFER CLOCK
4672 drw 23
n
FWFT/SI
IDT
72V255LA
72V265LA
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT72V255LA20TF | 功能描述:IC FIFO SS 8192X18 20NS 64-STQFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:90 系列:7200 功能:同步 存储容量:288K（16K x 18） 数据速率:100MHz 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（14x14） 包装:托盘 其它名称:72271LA10PF |
| IDT72V255LA20TF8 | 功能描述:IC FIFO SS 8192X18 20NS 64-STQFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:90 系列:7200 功能:同步 存储容量:288K（16K x 18） 数据速率:100MHz 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（14x14） 包装:托盘 其它名称:72271LA10PF |
| IDT72V261LA10PF | 功能描述:IC FIFO SS 8192X18 10NS 64QFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:90 系列:7200 功能:同步 存储容量:288K（16K x 18） 数据速率:100MHz 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（14x14） 包装:托盘 其它名称:72271LA10PF |
| IDT72V261LA10PF8 | 功能描述:IC FIFO SS 8192X18 10NS 64QFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:90 系列:7200 功能:同步 存储容量:288K（16K x 18） 数据速率:100MHz 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（14x14） 包装:托盘 其它名称:72271LA10PF |
| IDT72V261LA10PFG | 制造商:Integrated Device Technology Inc 功能描述:IC FIFO SS 8192X18 10NS 64TQFP 制造商:Integrated Device Technology Inc 功能描述:IC FIFO 144K 16KX9 3.3V TQFP64 制造商:Integrated Device Technology Inc 功能描述:IC, FIFO, 144K, 16KX9, 3.3V, TQFP64 |
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