参数资料
型号: IDT74FCT2373CTQG
厂商: IDT, Integrated Device Technology Inc
文件页数: 1/7页
文件大小: 0K
描述: IC TRANSP LATCH OCTAL 20-QSOP
标准包装: 55
系列: 74FCT
逻辑类型: 透明锁存器
电路: 8:8
输出类型: 三态
电源电压: 4.75 V ~ 5.25 V
独立电路: 1
延迟时间 - 传输: 2ns
输出电流高,低: 15mA,12mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-SSOP(0.154",3.90mm 宽)
供应商设备封装: 20-QSOP
包装: 管件
其它名称: 74FCT2373CTQG
INDUSTRIALTEMPERATURERANGE
IDT74FCT2373AT/CT
FASTCMOSOCTALTRANSPARENTLATCH
1
SEPTEMBER 2009
INDUSTRIAL TEMPERATURE RANGE
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
2009 Integrated Device Technology, Inc.
DSC-5497/7
FEATURES:
A and C grades
Low input and output leakage
≤≤≤≤≤1A (max.)
CMOS power levels
True TTL input and output compatibility:
–VOH = 3.3V (typ.)
–VOL = 0.3V (typ.)
Meets or exceeds JEDEC standard 18 specifications
Resistor outputs -15mA IOH, 12mA IOL
Reduced system switching noise
Available in QSOP package
FUNCTIONAL BLOCK DIAGRAM
IDT74FCT2373AT/CT
FAST CMOS OCTAL
TRANSPARENT LATCH
DESCRIPTION:
The FCT2373T is an octal transparent latch built using an advanced dual
metal CMOS technology. These octal latches have 3-state outputs and are
intended for bus oriented applications. The flip-flops appear transparent to
the data when Latch Enable (LE) is high. When LE is low, the data that meets
the set-up time is latched. Data appears on the bus when the Output Enable
(
OE) is low. When OE is high, the bus output is in the high-impedance state.
The FCT2373T has balanced drive outputs with current limiting resis-
tors. This offers low ground bounce, minimal undershoot and controlled
output fall times-reducing the need for external series terminating resistors.
The FCT2373T parts are plug-in replacements for FCT373T parts.
LE
D
G
O
O0
D0
D
G
O
O1
D1
D
G
O
O2
D2
D
G
O
O3
D3
D
G
O
O4
D4
D
G
O
O5
D5
D
G
O
O6
D6
D
G
O
O7
D7
OE
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IDT74FCT2373CTQG8 功能描述:IC TRANSP LATCH OCTAL 20-QSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 锁销 系列:74FCT 标准包装:48 系列:74VHCT 逻辑类型:D 型,可寻址 电路:1:8 输出类型:标准 电源电压:4.5 V ~ 5.5 V 独立电路:1 延迟时间 - 传输:6ns 输出电流高,低:8mA,8mA 工作温度:-55°C ~ 125°C 安装类型:表面贴装 封装/外壳:16-SOIC(0.154",3.90mm 宽) 供应商设备封装:16-SOIC 包装:管件
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