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参数资料
| 型号： | IDT74FST3861PG8 |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 总线收发器 |
| 英文描述： | CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24 |
| 封装： | TSSOP-24 |
| 文件页数： | 3/5页 |
| 文件大小： | 70K |
| 代理商： | IDT74FST3861PG8 |
IDT74FST3861
10-BIT, TWO PORT BUS SWITCH
COMMERCIAL TEMPERATURE RANGE
3
POWER SUPPLY CHARACTERISTICS
Symbol
Parameter
Test Conditions(1)
Min.
Typ.(2)
Max.
Unit
ICC
Quiescent Power Supply Current
TTL Inputs HIGH
VCC = Max.
VIN = 3.4V(3)
—0.5
1.5
mA
ICCD
Dynamic Power Supply
Current(4,5)
VCC = Max.
Outputs Open
VIN = VCC
VIN = GND
—0.3
0.4
mA/
MHz/
1 Enable Pin Toggling
50% Duty Cycle
Enable
IC
Total Power Supply Current(6)
VCC = Max.
Outputs Open
1 Enable Pin Toggling
VIN = VCC
VIN = GND
—3.0
4.0
mA
fi = 10MHz
50% Duty Cycle
VIN = 3.4
VIN = GND
—3.3
4.8
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
TA = –40°C to +85°C
2. Typical values are at VCC = 5.0V, +25°C ambient.
3. Per TTL driven input (VIN = 3.4V). All other inputs at VCC or GND. Switch inputs do not contribute to
ICC.
4. This parameter represents the current required to switch the internal capacitance of the control inputs at the specified frequency.
Switch inputs generate no significant power supply currents as they transition. This parameter is not directly testable,
but is derived for use in Total Power Supply Calculations.
5. CPD = ICCD/VCC
CPD = Power Dissipation Capacitance
6. IC = IQUIESCENT + IINPUTS + IDYNAMIC
IC = ICC +
ICC DHNT + ICCD (fiN)
ICC = Quiescent Current
ICC = Power Supply Current for a TTL High Input (VIN = 3.4V)
DH = Duty Cycle for TTL Inputs High
NT = Number of TTL Inputs at DH
ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL)
fi = Control Input Frequency
N = Number of Control Inputs Toggling at fi
SWITCHING CHARACTERISTICS OVER OPERATING RANGE
Following Condition Apply Unless Otherwise Specified:
Commercial: TA = –40°C to +85°C, VCC = 5.0V ±10%
Symbol
Description(1)
Min.
Typ.
Max.
Unit
tPLH
tPHL
Data Propagation Delay
A to B, B to A(2)
—
0.25
ns
tPZH
tPZL
Switch CONNECT Delay
OE to A or B
1.5
—
6.5
ns
tPHZ
tPLZ
Switch DISCONNECT Delay
OE to A or B
1.5
—
5.5
ns
|QCI|
Charge Injection During Switch
DISCONNECT OE to A or B(3)
—1.5
—
pC
NOTES:
1. See test circuits and waveforms.
2. The bus switch contributes no Propagation Delay other than the RC Delay of the
load interacting with the RC of the switch.
3. |QCI| Is the charge injection for a single switch DISCONNECT and applies to either single switches or multiplexers.
|QDCI| Is the charge injection for a multiplexer as the multiplexed port switches from one path to another. Charge injection is
reduced because the injection from the DISCONNECT of the first path is compensated by the CONNECT of the second path.
4246 tbl 07
4246 tbl 08
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相关代理商/技术参数 |
参数描述 |
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| IDT74FST6800PG | 制造商:Integrated Device Technology Inc 功能描述: 制造商:Integrated Device Technology Inc 功能描述:CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24 |
| IDT74FST6800PGG | 功能描述:IC BUS SWITCH PRECHARGED 24TSSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 信号开关，多路复用器，解码器 系列:74FST 标准包装:48 系列:74VHC 类型:多路复用器 电路:4 x 2:1 独立电路:1 输出电流高，低:8mA，8mA 电压电源:单电源 电源电压:2 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:管件 |
| IDT74FST6800PGG8 | 功能描述:IC BUS SWITCH 10BIT 24-TSSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 信号开关，多路复用器，解码器 系列:74FST 标准包装:48 系列:74VHC 类型:多路复用器 电路:4 x 2:1 独立电路:1 输出电流高，低:8mA，8mA 电压电源:单电源 电源电压:2 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:管件 |
| IDT74FST6800QG | 功能描述:IC BUS SWITCH 10BIT 24-QSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 信号开关，多路复用器，解码器 系列:74FST 标准包装:48 系列:74VHC 类型:多路复用器 电路:4 x 2:1 独立电路:1 输出电流高，低:8mA，8mA 电压电源:单电源 电源电压:2 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:管件 |
| IDT74FST6800QG8 | 功能描述:IC BUS SWITCH 10BIT 24-QSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 信号开关，多路复用器，解码器 系列:74FST 标准包装:48 系列:74VHC 类型:多路复用器 电路:4 x 2:1 独立电路:1 输出电流高，低:8mA，8mA 电压电源:单电源 电源电压:2 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:管件 |
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