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| 型号： | IDTAMB0480A5RJ |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 1/15页 |
| 文件大小： | 0K |
| 描述： | IC MEMORY BUFFER ADV DIMM 655BGA |
| 标准包装： | 40 |
| 电源电压： | 1.425 V ~ 1.59 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 655-BFBGA，FCBGA |
| 供应商设备封装： | 655-FCBGA（19.5x24.5） |
| 包装： | 托盘 |
| 其它名称： | AMB0480A5RJ |
1
IDTAMB0480
ADVANCEDMEMORYBUFFERFORFULLYBUFFEREDDIMM
COMMERCIALTEMPERATURERANGE
APRIL 2006
2006 Integrated Device Technology, Inc.
DSC - 7042/2
c
COMMERCIAL TEMPERATURE RANGE
FEATURES:
Advanced Memory Buffer for Fully buffered DIMMs
3.2 and 4 Gbit/s serial speeds (DDR2-533 and 667 DRAM)
Support for up to eight DIMMs per channel
Repeater Mode for extending FB-DIMM links
Northbound and Southbound single lane fail over and channel
error detection
Voltage and Timing margin high-speed I/O test capability
Fully Supports the FB-DIMM configuration register set
Test features supported include:
- Integrated thermal sensor and status indicator
- Supports MEMBIST, IBIST and Virtual Host mode
- Transparent mode and direct access mode for DRAM testing
Complies with JEDEC Architecture and Protocol Specification
Available in 655 ball FCBGA package
EXPANDEDFEATURES:
Wide range DDR Timing Control
Superfine adjustment for DDR timing
Wide range of DDR slew rate control
Slew rate controllable independent of output impedance
High speed SMBus in test mode
IBIST IDT PRBS Generator
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
DESCRIPTION:
The fully buffered dual in-line memory module (FB-DIMM) is the next
generation memory architecture to meet the growing memory requirement of
serversandworkstations.TheIDTAdvancedMemoryBuffer(AMB)chipisthe
essential building block located on each FB-DIMM. The IDT AMB receives
commands and data from the host controller to control and write/read data to/
fromtheDRAMsontheDIMM.Commandsandwritedataaresentsouthbound
from the host controller to AMBs in a daisy chain fashion and interpreted by the
target AMB. Status and read data are sent northbound from AMBs to the host
controlleralsoinadaisychainfashion,passingthroughnon-targetAMBs.This
uniquechannelstructurealleviatesbufferloadingissuescommoninregistered
DIMM technology, enabling designers to use a large number of DIMMs within
a single system.
IDTAMB0480complieswiththelatest JEDECdefinedFB-DIMMArchitecture
and Protocol Specification and supports DDR2-533 and DDR2-667 DRAM.
It also enables serial data transfer at 3.2 and 4.0Gbps. The IDTAMB0480
supportsservers,workstations,storagedevicesandcommunicationapplications
that support the next generation FB-DIMM architecture.
IDTAMB0480
PRODUCT
BRIEF
ADVANCED MEMORY BUFFER
FOR FULLY BUFFERED DIMM
MODULES
Host
Memory
Controller
DDR2
14
10
Up to 8 modules
DDR2
IDT
AMB
DDR2
IDT
AMB
IDT
AMB
IDT
AMB
FDB MEMORY CHANNEL
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| IDTAMB0480A5RJ8 | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 类别:集成电路 (IC) >> 逻辑 - 专用逻辑 系列:- 产品变化通告:Product Discontinuation 25/Apr/2012 标准包装:1,500 系列:74SSTV 逻辑类型:DDR 的寄存缓冲器 电源电压:2.3 V ~ 2.7 V 位数:14 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:48-TFSOP（0.240"，6.10mm 宽） 供应商设备封装:48-TSSOP 包装:带卷 (TR) |
| IDTAMB0482C1RJ | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 类别:集成电路 (IC) >> 接口 - 信号缓冲器，中继器，分配器 系列:* 标准包装:160 系列:- 类型:转发器 Tx/Rx类型:以太网 延迟时间:- 电容 - 输入:- 电源电压:2.37 V ~ 2.63 V 电流 - 电源:60mA 安装类型:表面贴装 封装/外壳:64-TQFP 裸露焊盘 供应商设备封装:64-TQFP-EP（10x10） 包装:托盘 其它名称:Q5134101 |
| IDTAMB0482C1RJ8 | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 类别:集成电路 (IC) >> 接口 - 信号缓冲器，中继器，分配器 系列:* 标准包装:160 系列:- 类型:转发器 Tx/Rx类型:以太网 延迟时间:- 电容 - 输入:- 电源电压:2.37 V ~ 2.63 V 电流 - 电源:60mA 安装类型:表面贴装 封装/外壳:64-TQFP 裸露焊盘 供应商设备封装:64-TQFP-EP（10x10） 包装:托盘 其它名称:Q5134101 |
| IDTAMB0483D0RJ | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 类别:集成电路 (IC) >> 接口 - 信号缓冲器，中继器，分配器 系列:* 标准包装:160 系列:- 类型:转发器 Tx/Rx类型:以太网 延迟时间:- 电容 - 输入:- 电源电压:2.37 V ~ 2.63 V 电流 - 电源:60mA 安装类型:表面贴装 封装/外壳:64-TQFP 裸露焊盘 供应商设备封装:64-TQFP-EP（10x10） 包装:托盘 其它名称:Q5134101 |
| IDTAMB0483D0RJ8 | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 类别:集成电路 (IC) >> 接口 - 信号缓冲器，中继器，分配器 系列:* 标准包装:160 系列:- 类型:转发器 Tx/Rx类型:以太网 延迟时间:- 电容 - 输入:- 电源电压:2.37 V ~ 2.63 V 电流 - 电源:60mA 安装类型:表面贴装 封装/外壳:64-TQFP 裸露焊盘 供应商设备封装:64-TQFP-EP（10x10） 包装:托盘 其它名称:Q5134101 |
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