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参数资料
| 型号： | IDTQS33X2253Q18 |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 编、解码器及复用、解复用 |
| 英文描述： | HEX MULTIPLEXER, PDSO48 |
| 封装： | QVSOP-48 |
| 文件页数： | 3/5页 |
| 文件大小： | 58K |
| 代理商： | IDTQS33X2253Q18 |
3
IDTQS33X253
HIGH-SPEED CMOS QUICKSWITCH MULTIWIDTH 24:6 MUX/DEMUX
INDUSTRIALTEMPERATURERANGE
TYPICAL ON RESISTANCE vs VIN AT VCC = 5V
RON
(ohms)
VIN
(Volts)
80
70
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Industrial: TA = -40°C to +85°C, VCC = 5.0V ± 5%
Symbol
Parameter
Test Conditions
Min.
Typ.(1)
Max.
Unit
VIH
Input HIGH Voltage
Guaranteed Logic HIGH for Control Inputs
2
—
V
VIL
Input LOW Voltage
Guaranteed Logic LOW for Control Inputs
—
0.8
V
IIN
Input Leakage Current (Control Inputs)
0V
≤ VIN ≤ Vcc
——
±1
A
IOZ
Off-State Current (Hi-Z)
0V
≤ VOUT ≤ Vcc
——
±1
A
RON
Switch ON Resistance
Vcc = Min., VIN = 0V
, ION = 30mA
20
28
40
RON
Switch ON Resistance
Vcc = Min., VIN = 2.4V
, ION = 15mA
20
35
48
VP
Pass Voltage (2)
VIN = Vcc = 5V, IOUT = -5
A
3.7
4
4.2
V
NOTES:
1. Typical values are at VCC = 5.0V, TA = 25°C.
2. Pass voltage is guaranteed but not production tested.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IDTQS33X253 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH MULTIWIDTH 24:6 MUX/DEMUX |
| IDTQS33X253Q1 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH MULTIWIDTH 24:6 MUX/DEMUX |
| IDTQS33X257 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH 24:12 MUX/DEMUX |
| IDTQS33X257Q1 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH 24:12 MUX/DEMUX |
| IDTQS33X257Q1G | 功能描述:IC MUX/DEMUX QUAD 1X2 48QVSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 其它有关文件:STG4159 View All Specifications 标准包装:5,000 系列:- 功能:开关 电路:1 x SPDT 导通状态电阻:300 毫欧 电压电源:双电源 电压 - 电源，单路/双路(±):±1.65 V ~ 4.8 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:7-WFBGA，FCBGA 供应商设备封装:7-覆晶 包装:带卷 (TR) |
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