参数资料
型号: ILX103A
厂商: Sony Corporation
英文描述: 3000-pixel CCD Linear Image Sensor (B/W)
中文描述: 3000像素CCD线性图像传感器(黑/白)
文件页数: 10/12页
文件大小: 100K
代理商: ILX103A
– 10 –
ILX103A
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive
shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Cer-SIP Packages
The following points should be observed when handling and installing cer-SIP packages.
a) Remain within the following limits when applying static load to the ceramic portion of the package:
(1)Compressive strength:39N/surface (Do not apply load more than 0.5mm inside the outer perimeter of
the glass portion.)
(2)Shearing strength: 29N/surface
(3)Tensile strength: 29N/surface
(4)Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic
layers are shielded by low-melting glass,
(1)Applying repetitive bending stress to the external leads.
(2)Applying heat to the external leads for an extended period of time with a soldering iron.
(3)Rapid cooling or heating.
(4)Applying a load or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5)Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after it
has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W
soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
Upper ceramic layer
39N
Lower ceramic layer
Low-melting glass
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
相关PDF资料
PDF描述
ILX115LA 5000-pixel X 3 line CCD Linear Sensor (Color)
ILX128MA 5350-pixel X 6-line CCD Linear Sensor (Color)
ILX137K 10700-pixel ?6-line CCD Linear Sensor (Color)
ILX503 2048-pixel CCD Linear Image Sensor (B/W)
ILX503A 2048-pixel CCD Linear Image Sensor (B/W)
相关代理商/技术参数
参数描述
ILX115LA 制造商:SONY 制造商全称:Sony Corporation 功能描述:5000-pixel X 3 line CCD Linear Sensor (Color)
ILX128MA 制造商:SONY 制造商全称:Sony Corporation 功能描述:5350-pixel X 6-line CCD Linear Sensor (Color)
ILX137K 制造商:SONY 制造商全称:Sony Corporation 功能描述:10700-pixel ?6-line CCD Linear Sensor (Color)
ILX146K 制造商:未知厂家 制造商全称:未知厂家 功能描述:The Industrys First Digital Copier CCD Linear Sensor with RGB Adjacent 3-Line Plus Monochrome 1-Line 7600-Pixel Sensors
ILX207DW 制造商:INTEGRAL 制造商全称:INTEGRAL 功能描述:Interface IC of data serial transfer with one supply voltage