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参数资料
| 型号： | ILX115LA |
| 厂商： | Sony Corporation |
| 英文描述： | 5000-pixel X 3 line CCD Linear Sensor (Color) |
| 中文描述： | 5000像素× 3线CCD线性传感器（彩色） |
| 文件页数： | 10/12页 |
| 文件大小： | 161K |
| 代理商： | ILX115LA |
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ILX115LA
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Cer-DIP Packages
The following points should be observed when handling and installing cer-DIP packages.
a) Remain within the following limits when applying a static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic
layers are shielded by low-melting glass,
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with a soldering iron.
(3) Rapid cooling or heating.
(4) Applying a load or impact to a limited portion of the low-melting glass with a small-tipped tool such
as tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board
after it has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded
30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool
sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric
desoldering tool, ground the controller. For the control system, use a zero cross type.
Upper ceramic layer
39N
Lower ceramic layer
Low-melting glass
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
相关PDF资料 |
PDF描述 |
|---|---|
| ILX128MA | 5350-pixel X 6-line CCD Linear Sensor (Color) |
| ILX137K | 10700-pixel ?6-line CCD Linear Sensor (Color) |
| ILX503 | 2048-pixel CCD Linear Image Sensor (B/W) |
| ILX503A | 2048-pixel CCD Linear Image Sensor (B/W) |
| ILX505A | 2592-pixel CCD Linear Image Sensor (B/W) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ILX128MA | 制造商:SONY 制造商全称:Sony Corporation 功能描述:5350-pixel X 6-line CCD Linear Sensor (Color) |
| ILX137K | 制造商:SONY 制造商全称:Sony Corporation 功能描述:10700-pixel ?6-line CCD Linear Sensor (Color) |
| ILX146K | 制造商:未知厂家 制造商全称:未知厂家 功能描述:The Industrys First Digital Copier CCD Linear Sensor with RGB Adjacent 3-Line Plus Monochrome 1-Line 7600-Pixel Sensors |
| ILX207DW | 制造商:INTEGRAL 制造商全称:INTEGRAL 功能描述:Interface IC of data serial transfer with one supply voltage |
| ILX208DW | 制造商:INTEGRAL 制造商全称:INTEGRAL 功能描述:Interface IC of data serial transfer with one supply voltage |
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