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参数资料
| 型号： | ILX548K |
| 厂商： | Sony Corporation |
| 英文描述： | 5340 pixel 】 3 line CCD Linear Sensor (Color) |
| 中文描述： | 5340像素】三线阵CCD线性传感器（彩色） |
| 文件页数： | 9/11页 |
| 文件大小： | 135K |
| 代理商： | ILX548K |
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ILX548K
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the package to crack or dust to be generated.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
(6) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(7) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board after
it has already been soldered.
39N
Lower ceramic layer
Upper ceramic layer
Low-melting glass
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
Plastic portion
Cover glass
39N
Ceramic portion
Adhesive
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
相关PDF资料 |
PDF描述 |
|---|---|
| ILX550K | 10680 pixel X 3 line CCD Linear Sensor (Color) |
| ILX551A | 2048-pixel CCD Linear Sensor (B/W) |
| ILX551B | 2048-pixel CCD Linear Sensor (B/W) |
| ILX553A | 5150-pixel CCD Linear Sensor (B/W) |
| ILX553B | 5150-pixel CCD Linear Sensor B W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ILX550K | 制造商:SONY 制造商全称:Sony Corporation 功能描述:10680 pixel X 3 line CCD Linear Sensor (Color) |
| ILX551A | 制造商:SONY 制造商全称:Sony Corporation 功能描述:2048-pixel CCD Linear Sensor (B/W) |
| ILX551B | 制造商:SONY 制造商全称:Sony Corporation 功能描述:2048-pixel CCD Linear Sensor (B/W) |
| ILX553A | 制造商:SONY 制造商全称:Sony Corporation 功能描述:5150-pixel CCD Linear Sensor (B/W) |
| ILX553B | 制造商:SONY 制造商全称:Sony Corporation 功能描述:5150-pixel CCD Linear Sensor B W |
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