参数资料
型号: IN74LVU04D
厂商: INTEGRAL JOINT STOCK COMPANY
元件分类: 电容
英文描述: CERAMIC CHIP/MIL-PRF-55681
中文描述: 陶瓷芯片/mil-prf-55681
文件页数: 6/6页
文件大小: 140K
代理商: IN74LVU04D
IN74LVU04
6
CHIP PAD DIAGRAM IZ74LVU04
Pad size 0.108 x 0.108 mm
(Pad size is given as per metallization layer)
Thickness of chip 0.46
±
0,02 mm
PAD LOCATION
Pad No
01
02
03
04
05
06
07
08
09
10
11
12
13
14
Symbol
A1
Y1
A2
Y2
A3
Y3
GND
Y4
A4
Y5
A5
Y6
A6
V
CC
X
Y
0.130
0.130
0.381
0.616
0.881
1.116
1.115
1.115
1.115
0.804
0.569
0.378
0.143
0.130
0.463
0.230
0.126
0.126
0.126
0.126
0.631
0.846
1.181
1.194
1.194
1.194
1.194
0.813
01
02
03
04
05
06
07
08
09
10
11
12
13
14
1
±
1.33 0.03
Chip marking
IN74LVU04
(x=0.130; y=0.130
)
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