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参数资料
| 型号： | IP3337CX18 |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 电路保护 |
| 英文描述： | 7-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4 |
| 封装： | IP3337CX18/LF/P<NAX000|<<<1<Always Pb-free,; |
| 文件页数： | 11/12页 |
| 文件大小： | 84K |
| 代理商： | IP3337CX18 |
IP3337CX18_2
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 10 March 2009
8 of 12
NXP Semiconductors
IP3337CX18
7-channel integrated LC-lter network with ESD input protection
9.
Soldering of WLCSP packages
9.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
9.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reow soldering itself
9.3 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 8) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classied in accordance with Table 6.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 8.
Table 6.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IP3337CX18/LF | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:7-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4 |
| IP3337CX18/LF/P,13 | 功能描述:ESD 抑制器 7-CH INTEGRATED LC-FILTER RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP3337CX18_09 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:7-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4 |
| IP3338CX24 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:10-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4 |
| IP3338CX24/LF | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:10-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4 |
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