参数资料
型号: IP3348CX5
厂商: NXP Semiconductors N.V.
元件分类: 电路保护
英文描述: Integrated multi channel LC-filter network for high-speed data interfaces with ESD protection to IEC 61000-4-2 level 4
封装: IP3348CX10<NAX000|<<<1<Always Pb-free,;IP3348CX15<NAX000|<<<1<Always Pb-free,;IP3348CX20<NAX000|<<<1<Always Pb-free,;IP3348CX5<NAX000|<<<1<A
文件页数: 4/16页
文件大小: 183K
代理商: IP3348CX5
IP3348CX5_CX10_CX15_CX20
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NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1.1 — 4 April 2011
12 of 16
NXP Semiconductors
IP3348CX5/CX10/CX15/CX20
Multi channel LC-filter network for high-speed data interfaces
9.
Design and assembly recommendations
9.1 PCB design guidelines
It is recommended, for optimum performance, to use a Non-Solder Mask Defined
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
Refer to Table 11 for the recommended PCB design parameters.
9.2 PCB assembly guidelines for Pb-free soldering
Table 11.
Recommended PCB design parameters
Parameter
Value or specification
PCB pad diameter
250
μm
Micro-via diameter
100
μm (0.004 inch)
Solder mask aperture diameter
325
μm
Copper thickness
20
μm to 40 μm
Copper finish
AuNi
PCB material
FR4
Table 12.
Assembly recommendations
Parameter
Value or specification
Solder screen aperture diameter
325
μm
Solder screen thickness
100
μm (0.004 inch)
Solder paste: Pb-free
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
Solder to flux ratio
50 : 50
Solder reflow profile
The device is capable of withstanding at least three reflows of this profile.
Fig 15. Pb-free solder reflow profile
001aai943
Treflow(peak)
250
230
217
T
(
°C)
cooling rate
preheat
t1
t5
t4
t3
t2
t (s)
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