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参数资料
| 型号： | IP4358CX6,135 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 7/11页 |
| 文件大小： | 0K |
| 描述： | IC ESD PROTECTION |
| 标准包装： | 4,500 |
| 电压 - 反向隔离（标准值）： | 5.5V |
| 电极标记： | 4 通道阵列 - 双向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UFBGA，WLCSP |
| 供应商设备封装： | 6-CSP（1.16x0.76） |
| 包装： | 带卷 (TR) |
NXP Semiconductors
IP4358CX6
Quad channel low capacitance ESD protection
8. Design and assembly recommendations
8.1 PCB design guidelines
It is recommended, for optimum performance, to use a Non-Solder Mask Defined
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
Refer to Table 6 for the recommended PCB design parameters.
Table 6.
Parameter
Recommended PCB design parameters
Value or specification
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
250 μ m
100 μ m (0.004 inch)
325 μ m
20 μ m to 40 μ m
AuNi or OSP
FR4
8.2 PCB assembly guidelines for Pb-free soldering
Table 7.
Parameter
Assembly recommendations
Value or specification
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
Solder reflow profile
T
( ° C)
T reflow(peak)
250
230
217
preheat
290 μ m
100 μ m (0.004 inch)
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
50 : 50
see Figure 6
cooling rate
t 1
t 2
t (s)
t 3
t 4
t 5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 6.
Pb-free solder reflow profile
IP4358CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
? NXP B.V. 2010. All rights reserved.
7 of 11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IP4359CX4 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual channel low capacitance high performance ESD protection |
| IP4359CX4/LF,135 | 功能描述:ESD 抑制器 2x Single Diode low capacitance RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4359CX4/LF-H500' | 制造商:NXP Semiconductors 功能描述:PHAIP4359CX4/LF-H500' ULPI HI-SPEED |
| IP4359CX4-H500 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual channel low capacitance high performance ESD protection |
| IP4359CX4LF | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual channel low capacitance high performance ESD protection |
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