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参数资料
| 型号： | IR2167 |
| 厂商： | International Rectifier |
| 英文描述： | PFC BALLAST CONTROL IC |
| 中文描述： | PFC的镇流器控制IC |
| 文件页数： | 28/30页 |
| 文件大小： | 937K |
| 代理商： | IR2167 |
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IR2167(
S
)
28
www.irf.com
Component Selection Tips
Supply Bypassing and pc Board Layout Rules
Component selection and placement on the pc board is ex-
tremely important when using power control ICs. VCC should
be bypassed to COM as close to the IC terminals as pos-
sible with a low ESR/ESL capacitor, as shown in Figure 25.
Figure 25:
Supply bypassing PCB layout example
A rule of thumb for the value of this bypass capacitor is to
keep its minimum value at least 2500 times the value of the
total input capacitance (Ciss) of the power transistors being
driven. This decoupling capacitor can be split between a
higher valued electrolytic type and a lower valued ceramic
type connected in parallel, although a good quality electro-
lytic (e.g., 10
μ
F) placed immediately adjacent to the VCC
and COM terminals will work well.
In a typical application circuit, the supply voltage to the IC is
normally derived by means of a high value startup resistor
(1/4W) from the rectified line voltage, in combination with a
charge pump from the output of the half-bridge. With this
type of supply arrangement, the internal 15.6V zener clamp
diode from VCC to COM will determine the steady state IC
supply voltage.
C
VCC
(surface
mount)
C
BOOT
D
Boot
(surface
mount)
(surface
mount)
C
VCC
(through hole)
pin 1
IR2167
Connecting the IC Ground (COM) to the Power
Ground
Both the low power control circuitry and low side gate driver
output stage grounds return to this lead within the IC. The
COM lead should be connected to the bottom terminal of the
current sense resistor in the source of the low side power
MOSFET using an individual pc board trace, as shown in
Figure 26. In addition, the ground return path of the timing
components and VCC decoupling capacitor should be con-
nected directly to the IC COM lead, and not via separate
traces or jumpers to other ground traces on the board.
Figure 26:
COM lead connection PCB layout example
These connection techniques prevent high current ground
loops from interfering with sensitive timing component op-
eration, and allows the entire control circuit to reject com-
mon-mode noise due to output switching.
C
VCC
(surface
mount)
C
VCC
(through hole)
IR2167
pin 1
cotiming
s
V
BUS
return
R
CS
(through hole)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IR2167PBF | 功能描述:IC PFC BALLAST CTLR 20DIP RoHS:是 类别:集成电路 (IC) >> PMIC - 照明，镇流器控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:CCFL 控制器 频率:40 ~ 80 kHz 电流 - 电源:5mA 电流 - 输出:- 电源电压:4.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) 其它名称:90-3991V+V01 |
| IR2167S | 功能描述:IC CNTRLR BALLAST PFC 20-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 照明，镇流器控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:CCFL 控制器 频率:40 ~ 80 kHz 电流 - 电源:5mA 电流 - 输出:- 电源电压:4.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) 其它名称:90-3991V+V01 |
| IR2167SPBF | 功能描述:IC CTLR BALLAST PFC 20-SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 照明，镇流器控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:CCFL 控制器 频率:40 ~ 80 kHz 电流 - 电源:5mA 电流 - 输出:- 电源电压:4.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) 其它名称:90-3991V+V01 |
| IR2167STRPBF | 功能描述:功率因数校正 IC PFC Ballast Control, Thermal Overload Protection, RoHS:否 制造商:Fairchild Semiconductor 开关频率:300 KHz 最大功率耗散: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Reel |
| IR2170 | 功能描述:IC CURRENT SENSE 600V 1MA 8-DIP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳流/电流管理 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 功能:电流开关 检测方法:- 精确度:±10% 输入电压:1.7 V ~ 5.5 V 电流 - 输出:600mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:10-UFQFN 供应商设备封装:10-UTQFN（1.4x1.8） 包装:管件 |
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