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参数资料
| 型号： | IR230SG06H |
| 元件分类： | 晶闸管 |
| 英文描述： | SCR |
| 封装： | 0.230 X 0.230 INCH, DIE-2 |
| 文件页数： | 1/3页 |
| 文件大小： | 108K |
| 代理商： | IR230SG06H |
1
www.irf.com
Junction Size:
Square 230 mils
Wafer Size:
4"
V
RRM
Class:
600 and 1200 V
Passivation Process:
Glassivated MESA
Reference IR Packaged Part:
n. a.
PHASE CONTROL THYRISTORS
IR230SG..HCB SERIES
Major Ratings and Characteristics
Parameters
Units
Test Conditions
V
TM
Maximum On-state Voltage
1.3 V
T
J
= 25°C, I
T
= 25 A
V
RRM
ReverseBreakdownVoltage
600 and 1200V
T
J
= 25°C, I
RRM
= 100 A
(1)
I
GT
Max. Required DC Gate Current to Trigger
60 mA
T
J
= 25° C, anode supply = 6 V, resistive load
V
GT
Max. Required DC Gate Voltage to Trigger
1.9 V
T
J
= 25° C, anode supply = 6 V, resistive load
I
H
HoldingCurrentRange
5 to 150 mA
Anode supply = 6 V, resistive load
I
L
Maximum Latching Current
400mA
Anode supply = 6 V, resistive load
Mechanical Characteristics
Nominal Back Metal Composition, Thickness
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
Nominal Front Metal Composition, Thickness
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
Chip Dimensions
230 x 230 mils (see drawing)
Wafer Diameter
100 mm, with std. < 100 > flat
Wafer Thickness
370 m ± 10 m
Maximum Width of Sawing Line
130 m
Reject Ink Dot Size
0.25 mm diameter minimum
Ink Dot Location
See drawing
Recommended Storage Environment
Storage in original container, in dessicated
nitrogen, with no contamination
Bulletin I0205J 07/98
(1) Nitrogen flow on die edge.
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